公开(公告)号：US20080171418A1

公开(公告)日：2008-07-17

申请号：US12054545

申请日：2008-03-25

申请人： Lawrence A. Clevenger ,  Louis L. Hsu ,  Cart J. Radens ,  Li-Kong Wang ,  Kwong Hon Wong

发明人： Lawrence A. Clevenger ,  Louis L. Hsu ,  Cart J. Radens ,  Li-Kong Wang ,  Kwong Hon Wong

IPC分类号： H01L21/02

CPC分类号： H01C7/005 ,  H01C7/006 ,  H01C17/075 ,  H01G4/18 ,  H01G4/33 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/5228 ,  H01L23/5328 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method and structure for an integrated circuit chip has a logic core which includes a plurality of insulating and conducting levels, an exterior conductor level and passive devices having a conductive polymer directly connected to the exterior conductor level. The passive devices contain RF devices which also includes resistor, capacitor, and/or inductor. The resistors can be serpentine resistors and the capacitors can be interdigitated capacitors.

摘要翻译： 集成电路芯片的方法和结构具有包括多个绝缘和导电水平的逻辑芯，外部导体水平和具有直接连接到外部导体水平的导电聚合物的无源器件。 无源器件包含还包括电阻器，电容器和/或电感器的RF器件。 电阻器可以是蛇形电阻器，电容器可以是交错电容器。