公开(公告)号：US20200039059A1

公开(公告)日：2020-02-06

申请号：US16601619

申请日：2019-10-15

Applicant: Channing Dewitt Wright

Inventor： Channing Dewitt Wright

IPC: B25H3/04 ,  B25H7/02 ,  B25H3/00 ,  A47F7/00 ,  B25H7/04

Abstract: An apparatus, method, and system for hardware mapping and management is disclosed. The apparatus may comprise a substrate housing hardware units associated with an object; one or more holes within the substrate for housing at least one hardware unit of the object are positioned based on a layout corresponding to the hardware units' assembly within the object.

公开(公告)号：US11045942B2

公开(公告)日：2021-06-29

申请号：US16601619

申请日：2019-10-15

Applicant: Channing Dewitt Wright

Inventor： Channing Dewitt Wright

IPC: B25H3/04 ,  A47F7/00 ,  B25H7/02 ,  B25H3/00 ,  B25H7/04

Abstract: An apparatus, method, and system for hardware mapping and management is disclosed. The apparatus may comprise a substrate housing hardware units associated with an object; one or more holes within the substrate for housing at least one hardware unit of the object are positioned based on a layout corresponding to the hardware units' assembly within the object.

公开(公告)号：US20180290291A1

公开(公告)日：2018-10-11

申请号：US15943260

申请日：2018-04-02

Applicant: Channing Dewitt Wright

Inventor： Channing Dewitt Wright

IPC: B25H3/04 ,  A47F7/00 ,  B25H3/00

Abstract: An Apparatus, Method, and System for Hardware Mapping and Management is disclosed. Apparatus comprises a substrate housing hardware units associated with an object; one or more holes within the substrate for housing at least one hardware unit of the object are positioned based on a layout corresponding to the hardware units' assembly within the object. A method providing a plurality of substrates for housing hardware comprised of at least two components and at least two hardware units for each component, configuring a first plurality of holes within a first substrate of the plurality of substrate, wherein the first plurality of holes are laid out within the first substrate at locations relative the location of hardware units within a first component, and configuring a second plurality of holes within a second substrate of the plurality of substrate, wherein the second plurality of holes are laid out within the second substrate at locations relative the location of hardware units within a second component.

公开(公告)号：US20170368676A1

公开(公告)日：2017-12-28

申请号：US15193029

申请日：2016-06-25

Applicant: Channing Dewitt Wright

Inventor： Channing Dewitt Wright

IPC: B25H3/04 ,  B25H3/00 ,  A47F7/00

CPC classification number: B25H3/04 ,  A47F7/0028 ,  B25H3/003

Abstract: A skyplate is the “knife block”of parts, tools, hardware or material.

公开(公告)号：US10471586B2

公开(公告)日：2019-11-12

申请号：US15943260

申请日：2018-04-02

Applicant: Channing Dewitt Wright

Inventor： Channing Dewitt Wright

IPC: B25H3/04 ,  A47F7/00 ,  B25H3/00 ,  B25H7/02

Abstract: An Apparatus, Method, and System for Hardware Mapping and Management is disclosed. Apparatus comprises a substrate housing hardware units associated with an object; one or more holes within the substrate for housing at least one hardware unit of the object are positioned based on a layout corresponding to the hardware units' assembly within the object. A method providing a plurality of substrates for housing hardware comprised of at least two components and at least two hardware units for each component, configuring a first plurality of holes within a first substrate of the plurality of substrate, wherein the first plurality of holes are laid out within the first substrate at locations relative the location of hardware units within a first component, and configuring a second plurality of holes within a second substrate of the plurality of substrate, wherein the second plurality of holes are laid out within the second substrate at locations relative the location of hardware units within a second component.