Modular packaging system, particularly for electronics
    7.
    发明授权
    Modular packaging system, particularly for electronics 失效
    模块化包装系统,特别适用于电子产品

    公开(公告)号:US4823952A

    公开(公告)日:1989-04-25

    申请号:US518365

    申请日:1983-07-29

    CPC分类号: G06F1/181 H05K5/0021

    摘要: A front cover is provided with an open area to accommodate visual displays, keyboards, switches, joy sticks and the like. A back cover, nestingly interfitting therewith, is closed, but provided with a recess, encompassing most of its back area. One or more identical nesting interfitting intermediate frames may be nested and stacked between the back cover and the front cover to form a package of any desired volume. The frames, back cover, and front cover are provided with means for mounting functional elements such as electrical circuit boards. The front cover and intermediate frames are provided with peripheral circumferential ribs. These ribs, and the slots therebetween, provide for a great variety of ways to mount the package, as does the rear recess in the back plate. The front cover may be identical or nearly identical to the intermediate frames. Functional elements may be mounted to the covers and frames during manufacture such that the covers and frames act as protective carriers during manufacture. After assembly, they provide a close package or case for the assembled unit.

    摘要翻译: 前盖设置有开放区域,以容纳视觉显示器,键盘,开关,操纵杆等。 与其嵌套的后盖封闭,但设置有包围其背部区域的大部分的凹部。 可以将一个或多个相同的嵌套互连中间框架嵌套并堆叠在后盖和前盖之间以形成任何所需体积的包装。 框架,后盖和前盖设置有用于安装诸如电路板的功能元件的装置。 前盖和中间框架设有周边圆周肋。 这些肋和它们之间的狭槽提供了各种各样的安装包装的方式,如背板中的后凹部一样。 前盖可以与中间框架相同或几乎相同。 功能元件可以在制造期间安装到盖和框架,使得盖和框架在制造期间用作保护性载体。 组装后,它们为组装的单元提供了一个封闭的封装或外壳。