LDD epitaxy for FinFETs
    1.
    发明授权
    LDD epitaxy for FinFETs 有权
    FinFET的LDD外延

    公开(公告)号:US08278179B2

    公开(公告)日:2012-10-02

    申请号:US12720476

    申请日:2010-03-09

    CPC classification number: H01L29/66795 H01L21/823821

    Abstract: A method of forming a semiconductor structure includes providing a substrate including a fin at a surface of the substrate, and forming a fin field-effect transistor (FinFET), which further includes forming a gate stack on the fin; forming a thin spacer on a sidewall of the gate stack; and epitaxially growing a epitaxy region starting from the fin. After the step of epitaxially growing the epitaxy region, a main spacer is formed on an outer edge of the thin spacer. After the step of forming the main spacer, a deep source/drain implantation is performed to form a deep source/drain region for the FinFET.

    Abstract translation: 一种形成半导体结构的方法包括在衬底的表面提供包括鳍的衬底,以及形成鳍状场效应晶体管(FinFET),其还包括在鳍上形成栅叠层; 在所述栅极堆叠的侧壁上形成薄的间隔物; 并从翅片开始外延生长外延区域。 在外延生长外延区域的步骤之后,在间隔物的外边缘上形成主间隔物。 在形成主间隔物的步骤之后,进行深源极/漏极注入以形成用于FinFET的深源极/漏极区域。

    LDD Epitaxy for FinFETs
    2.
    发明申请
    LDD Epitaxy for FinFETs 有权
    用于FinFET的LDD外延

    公开(公告)号:US20110223736A1

    公开(公告)日:2011-09-15

    申请号:US12720476

    申请日:2010-03-09

    CPC classification number: H01L29/66795 H01L21/823821

    Abstract: A method of forming a semiconductor structure includes providing a substrate including a fin at a surface of the substrate, and forming a fin field-effect transistor (FinFET), which further includes forming a gate stack on the fin; forming a thin spacer on a sidewall of the gate stack; and epitaxially growing a epitaxy region starting from the fin. After the step of epitaxially growing the epitaxy region, a main spacer is formed on an outer edge of the thin spacer. After the step of forming the main spacer, a deep source/drain implantation is performed to form a deep source/drain region for the FinFET.

    Abstract translation: 一种形成半导体结构的方法包括在衬底的表面提供包括鳍的衬底,以及形成鳍状场效应晶体管(FinFET),其还包括在鳍上形成栅叠层; 在所述栅极堆叠的侧壁上形成薄的间隔物; 并从翅片开始外延生长外延区域。 在外延生长外延区域的步骤之后,在间隔物的外边缘上形成主间隔物。 在形成主间隔物的步骤之后,进行深源极/漏极注入以形成用于FinFET的深源极/漏极区域。

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