公开(公告)号：US20120171372A1

公开(公告)日：2012-07-05

申请号：US12982755

申请日：2010-12-30

Applicant: Hk Looi ,  Cheng-hai Cheh

Inventor： Hk Looi ,  Cheng-hai Cheh

IPC: B05D5/10 ,  B05C11/00 ,  B05C5/00

CPC classification number: B05B13/0431 ,  B05C5/0204 ,  B05C5/0225 ,  B05C5/0291 ,  B05C11/1039

Abstract: In automated gluing systems for semiconductor device manufacture, an automatic shutter system is provided for use with an adhesive dispenser that is configured to deposit adhesive for joining elements during final assembly processes. A shutter is configured to interpose itself between a needle tip of the dispenser and a working surface, on which devices in process are positioned, while the dispenser is in a ready position and not actually delivering adhesive, and to withdraw from the interposed position as, or immediately before the needle tip descends to a dispensing position to deposit adhesive on a device. In this way, drops of adhesive that fall from the needle tip while in the ready position are captured by the shutter and prevented from falling onto a device in process in an unintended location of the device.

Abstract translation: 在用于半导体器件制造的自动胶粘系统中，提供自动快门系统以与粘合剂分配器一起使用，其被配置为在最终组装过程期间沉积用于接合元件的粘合剂。 快门被配置为将自身插入到分配器的针尖和工作表面之间，在该工作表面处于正在处理的装置中，而分配器处于就绪位置，而不是实际输送粘合剂，并且从插入位置退出， 或者在针尖下降到分配位置之前，以将粘合剂沉积在装置上。 以这种方式，在就绪位置从针尖落下的粘合剂滴被快门捕获并防止在设备的非预期位置中落在正在处理的设备上。

公开(公告)号：US20140000804A1

公开(公告)日：2014-01-02

申请号：US13539994

申请日：2012-07-02

Applicant: Han Kong Looi ,  Cheng-hai Cheh

Inventor： Han Kong Looi ,  Cheng-hai Cheh

IPC: B32B38/18 ,  B32B37/12

CPC classification number: H01L24/83 ,  H01L24/75 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/75263 ,  H01L2224/75745 ,  H01L2224/82214 ,  H01L2224/83192 ,  H01L2224/83874

Abstract: A pick and place system with an integrated light source to partially cure a light-curable adhesives onto which components have been placed. After a light-curable adhesive in liquid or low viscosity form is applied to a location on a substrate, a pick-and-place head uses a vacuum introduced to its nozzle-like opening to pick a component and place it on to the light-curable adhesive. The pick-and-place head then transmit an appropriate light through the same nozzle-like opening to at least partially cure the adhesive. The component becomes, therefore, at least partially fixed to the substrate and will not shift as the substrate is moved.

Abstract translation: 具有集成光源的拾取和放置系统，用于部分固化已经放置组件的可光固化粘合剂。 将液体或低粘度形式的可光固化粘合剂施加到基板上的位置之后，拾取头使用引入其喷嘴状开口的真空来挑选部件并将其放置在发光元件上， 可固化粘合剂。 拾取头然后通过相同的喷嘴状开口传递适当的光以至少部分地固化粘合剂。 因此，该部件至少部分地固定到基板上，并且将不会随着基板移动而移动。