Hybrid ionized physical vapor deposition of via and trench liners
    7.
    发明申请
    Hybrid ionized physical vapor deposition of via and trench liners 审中-公开
    通孔和沟槽衬垫的混合电离物理气相沉积

    公开(公告)号:US20070232060A1

    公开(公告)日:2007-10-04

    申请号:US11706502

    申请日:2007-02-15

    申请人: Chengyu Niu

    发明人: Chengyu Niu

    IPC分类号: H01L21/4763

    摘要: A hybrid ionized physical vapor deposition technique to form liner films for vias, trenches, and other structures of integrated circuits. The techniques involves depositing liner materials within a via, hole, trench, or other structure in a neutral state, using, for example, physical vapor deposition. The liner materials deposited in this step have an ionization ratio of less than ten percent, and no bias potential is applied to an underlying substrate. The technique also involves depositing liner materials in ionized form in the same via using ionized physical vapor deposition. The liner materials deposited in this step have an ionization ratio far more than ten percent, and an optional bias potential may be applied to the underlying substrate. After liner film is formed, any other suitable actions or processing steps may take place including building additional metallization and dielectric layers and vias or trenches to produce a multi-level interconnect system.

    摘要翻译: 混合电离物理气相沉积技术,用于形成用于通孔,沟槽和集成电路的其他结构的衬垫膜。 这些技术涉及使用例如物理气相沉积在中性状态的通孔,孔,沟槽或其它结构中沉积衬垫材料。 在该步骤中沉积的衬垫材料具有小于10%的电离比,并且没有偏压电位施加到下面的衬底。 该技术还涉及使用电离物理气相沉积在相同的通孔中沉积离子化形式的衬垫材料。 在该步骤中沉积的衬垫材料的离子化比率远高于百分之十,并且可以向底层衬底施加任选的偏置电位。 在形成衬里膜之后,可以发生任何其它合适的动作或处理步骤,包括建立附加的金属化和介电层以及通孔或沟槽以产生多层互连系统。