公开(公告)号：US20110128237A1

公开(公告)日：2011-06-02

申请号：US12629826

申请日：2009-12-02

Applicant: Fletcher R. ROTHKOPF ,  Stephen ZADESKY ,  Stephen Brian LYNCH ,  Chris D. PREST ,  Tang Yew TAN ,  Kyle Harris YEATES ,  Shin John CHOI ,  Richard Hung Minh DINH

Inventor： Fletcher R. ROTHKOPF ,  Stephen ZADESKY ,  Stephen Brian LYNCH ,  Chris D. PREST ,  Tang Yew TAN ,  Kyle Harris YEATES ,  Shin John CHOI ,  Richard Hung Minh DINH

IPC: H01J9/00 ,  G06F3/041

CPC classification number: G06F3/041

Abstract: Thinned-portion substrates and processing of thinned-portion substrates is provided. A portion of a substrate, such as a mother glass used in touch screen manufacturing, can be thinned by forming a cavity in a surface of the substrate. Surface structures, such as touch sensing circuitry and/or display circuitry, can then be formed on the thinned portion of the substrate. For example, touch screen components can be formed as surface structures including touch sensing circuitry and display circuitry on one or more thinned substrate portions through processes including depositing, masking, etching, doping, etc. The thinned substrate portion, including the surface structures formed thereon, can then be detached from the surrounding thicker part of the substrate. In this way, for example, the surrounding thicker part of the substrate can provide structural integrity during various other manufacturing processes, while allowing surface structures to be formed directly on a thinner substrate.

Abstract translation: 提供了薄壁部分基板和薄壁部分基板的加工。 基板的一部分，例如用于触摸屏制造的母玻璃，可以通过在基板的表面中形成空腔来减薄。 然后可以在衬底的薄化部分上形成诸如触摸感测电路和/或显示电路的表面结构。 例如，触摸屏部件可以通过包括沉积，掩模，蚀刻，掺杂等的工艺在一个或多个薄化的衬底部分上形成为包括触摸感测电路和显示电路的表面结构。包括其上形成的表面结构的薄化衬底部分 ，然后可以从基底的周围较厚的部分分离。 以这种方式，例如，衬底的周围较厚的部分可以在各种其它制造工艺期间提供结构完整性，同时允许在更薄的衬底上直接形成表面结构。