公开(公告)号：US06171174B2

公开(公告)日：2001-01-09

申请号：US09105980

申请日：1998-06-26

申请人： William Jarrett Campbell ,  Christopher Henry Raeder ,  Michael Lee Miller

发明人： William Jarrett Campbell ,  Christopher Henry Raeder ,  Michael Lee Miller

IPC分类号： B24B4900

CPC分类号： G05B19/41815 ,  B25J9/1669 ,  Y02P90/08

摘要： A system and method for controlling a polishing tool having multiple arms is provided. In accordance with one embodiment, a first removal rate for each arm based on a first wafer run is determined. A downforce adjustment input for each arm is then determined based on a process model, for the arms, which relates a removal rate for a given arm to downforce adjustments on each of the arms and using each first removal rate. The downforce adjustment input for each arm is provided to the polishing tool for polishing a subsequent run. In this manner, the method takes into account each arms removal rate dependency on the downforce adjustments for all of the arms. This can provide reduced removal rate variations between arms as well as between wafer lots and improve the characteristics of the ultimately formed semiconductor devices.

摘要翻译： 提供了一种用于控制具有多个臂的抛光工具的系统和方法。 根据一个实施例，确定基于第一晶片行程的每个臂的第一移除速率。 然后基于用于臂的过程模型来确定每个臂的下压力调整输入，其涉及给定臂的移除速率以降低每个臂上的调整并使用每个第一移除速率。 每个臂的下压力调节输入被提供给抛光工具，用于抛光后续的运行。 以这种方式，该方法考虑到对于所有臂的下压力调整的每个臂移除率的依赖性。 这可以提供臂之间以及晶片批次之间的降低的去除率变化，并且改善最终形成的半导体器件的特性。