公开(公告)号：US20060255517A1

公开(公告)日：2006-11-16

申请号：US11199076

申请日：2005-08-09

Applicant: Gwo-Shiang Lee ,  Wei-Chin Chen ,  Chuang-Ching Kang ,  Ching-Fang Ho

Inventor： Gwo-Shiang Lee ,  Wei-Chin Chen ,  Chuang-Ching Kang ,  Ching-Fang Ho

IPC: F16F1/36

CPC classification number: F16F1/065 ,  F16F1/373 ,  F16F3/10 ,  F16F13/005 ,  F16F2236/025

Abstract: A shock isolation system for electronic devices includes a first baseboard, a second baseboard and a plurality of helical springs interposed transversely between the first baseboard and the second baseboard. The helical springs can deform horizontally and vertically to isolate horizontal and vertical vibration-impact on the electronic devices. The first baseboard and the second baseboard further are bridged by a plurality of damping elements, which have damping characteristics to dissipate kinetic energy and reduce the vibration amplitude and instantaneous acceleration between the first baseboard and the second baseboard, thereby to enhancing the composite effect. The first baseboard further has a plurality of buffer struts to separate the first baseboard and the second baseboard, and prevent the second baseboard from directly hitting the first baseboard.

Abstract translation: 用于电子设备的防震隔离系统包括第一基板，第二基板和横向插入在第一基板和第二基板之间的多个螺旋弹簧。 螺旋弹簧可以水平和垂直变形，以隔离电子设备上的水平和垂直振动冲击。 第一基板和第二基板进一步由多个阻尼元件桥接，所述阻尼元件具有阻尼特性以消散动能并减小第一基板和第二基板之间的振动振幅和瞬时加速度，由此增强复合效应。 第一基板还具有多个缓冲支柱以分离第一基板和第二基板，并且防止第二基板直接撞击第一基板。