公开(公告)号：US20100053896A1

公开(公告)日：2010-03-04

申请号：US12406929

申请日：2009-03-18

申请人： Chien-Fu Chen ,  Yi-Ping Hsieh ,  Chung-Chen Chen

发明人： Chien-Fu Chen ,  Yi-Ping Hsieh ,  Chung-Chen Chen

IPC分类号： H05K7/20 ,  F28F13/00

CPC分类号： G03B21/16

摘要： An electronic device includes a heat dissipation system and an operating system. The heat dissipation system includes a housing, a first heat dissipation module received in the housing, heat pipes extending from the first heat dissipation module through the housing. The operating system includes a dust-proof housing, a heat source and a heat dissipation device. The heat source is received in the dust-proof housing and generates heat. The cooling module is adhered to an outer surface of the dust-proof housing to be cooled and attaches the heat pipes to the first heat dissipation module. The outer surface of the dust-proof housing is adjacent to the housing. The heat pipes transfer heat from the operating system into the first heat dissipation module.

摘要翻译： 电子设备包括散热系统和操作系统。 散热系统包括壳体，容纳在壳体中的第一散热模块，从第一散热模块延伸穿过壳体的热管。 操作系统包括防尘外壳，热源和散热装置。 热源被接收在防尘壳体中并产生热量。 冷却模块粘附到要冷却的防尘壳体的外表面，并将热管附接到第一散热模块。 防尘外壳的外表面与外壳相邻。 热管将热量从操作系统传递到第一散热模块。

公开(公告)号：US08052282B2

公开(公告)日：2011-11-08

申请号：US12406929

申请日：2009-03-18

申请人： Chien-Fu Chen ,  Yi-Ping Hsieh ,  Chung-Chen Chen

发明人： Chien-Fu Chen ,  Yi-Ping Hsieh ,  Chung-Chen Chen

IPC分类号： G03B21/16

CPC分类号： G03B21/16

摘要： An electronic device includes a heat dissipation system and an operating system. The heat dissipation system includes a housing, a first heat dissipation module received in the housing, heat pipes extending from the first heat dissipation module through the housing. The operating system includes a dust-proof housing, a heat source and a heat dissipation device. The heat source is received in the dust-proof housing and generates heat. The cooling module is adhered to an outer surface of the dust-proof housing to be cooled and attaches the heat pipes to the first heat dissipation module. The outer surface of the dust-proof housing is adjacent to the housing. The heat pipes transfer heat from the operating system into the first heat dissipation module.

摘要翻译： 电子设备包括散热系统和操作系统。 散热系统包括壳体，容纳在壳体中的第一散热模块，从第一散热模块延伸穿过壳体的热管。 操作系统包括防尘外壳，热源和散热装置。 热源被接收在防尘壳体中并产生热量。 冷却模块粘附到要冷却的防尘壳体的外表面，并将热管附接到第一散热模块。 防尘外壳的外表面与外壳相邻。 热管将热量从操作系统传递到第一散热模块。