公开(公告)号：US10766171B2

公开(公告)日：2020-09-08

申请号：US15540482

申请日：2014-12-31

申请人： Brian Wilson ,  Jim Endicott ,  Chad Lane ,  Clay Bohn

发明人： Brian Wilson ,  Jim Endicott ,  Chad Lane ,  Clay Bohn

IPC分类号： B29C39/40 ,  B29C33/00 ,  B29C37/00 ,  B29D30/02 ,  B29C39/00 ,  B29C39/26 ,  B60C7/18 ,  B29K75/00 ,  B60C7/00 ,  B29C67/24

摘要： Particular embodiments of the invention include apparatus and methods for compensating for shrinkage of a polymeric material in a mold during curing operations. Embodiments of the method include providing a mold comprising a molding cavity defining an interior mold volume separated from an exterior environment and introducing a volume of polymeric material into the molding cavity. Such methods further include impeding the development of a void in the volume of polymeric material by, either: isolating the volume of polymeric material within the molding cavity from the exterior environment, or reducing the interior mold volume of the molding cavity to at least substantially consume a volume of polymeric material shrinkage. Such methods further include curing the polymeric material to form a molded polymeric form.