公开(公告)号：US06830192B1

公开(公告)日：2004-12-14

申请号：US09692371

申请日：2000-10-20

申请人： Johannes Krul ,  Cornelius Maria Hart ,  Dagobert Michel de Leeuw ,  Wilhelm Bernardus de Hesse ,  Marco Matters

发明人： Johannes Krul ,  Cornelius Maria Hart ,  Dagobert Michel de Leeuw ,  Wilhelm Bernardus de Hesse ,  Marco Matters

IPC分类号： G06K1906

CPC分类号： D21H21/48 ,  G06K19/02 ,  G06K19/07743

摘要： The invention relates to a substrate which is made from paper and is provided with at least one integrated circuit which is produced from a semiconductive organic polymer. A semiconductive organic polymer of this nature, when used as the base material for the integrated circuit, leads to the possibility of directly producing the substrate in the required thickness, to the need for support layers and/or protective layers being eliminated, and to the possibility of reducing the cost price of the substrate compared to substrates which comprise an integrated circuit of the silicon type.

摘要翻译： 本发明涉及由纸制成并具有由半导体有机聚合物制成的至少一个集成电路的基板。 这种性质的半导体有机聚合物当用作集成电路的基底材料时，导致直接生产所需厚度的衬底，消除对支撑层和/或保护层的需要的可能性，以及 与包括硅类型的集成电路的衬底相比，降低衬底的成本价格的可能性。