Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same
    1.
    发明授权
    Array printed circuit board, method of replacing defective single printed circuit board of the same, and method of manufacturing electronic apparatus using the same 有权
    阵列印刷电路板,其替代有缺陷的单一印刷电路板的方法,以及使用其制造电子设备的方法

    公开(公告)号:US09451691B2

    公开(公告)日:2016-09-20

    申请号:US14458249

    申请日:2014-08-12

    Abstract: An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.

    Abstract translation: 提供阵列印刷电路板(PCB),其中可以容易地更换有缺陷的单个PCB。 还提供了更换有缺陷的单个PCB的方法和制造电子设备的方法。 阵列PCB可以包括多个单个PCB。 轨道部分可以围绕单个PCB。 多个翼片路线部分将单个PCB连接到轨道部分,每个翼片路线部分包括至少一对通孔电极。 测试端子部分可以形成在轨道部分的一侧,并且可以包括多个测试端子。 所述至少一对通孔电极可以包括邻近所述轨道部分设置并电连接到相应测试端子的第一通孔电极,以及邻近并电连接到相应的单个PCB布置的第二通孔电极。

    ARRAY PRINTED CIRCUIT BOARD, METHOD OF REPLACING DEFECTIVE SINGLE PRINTED CIRCUIT BOARD OF THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS USING THE SAME
    2.
    发明申请
    ARRAY PRINTED CIRCUIT BOARD, METHOD OF REPLACING DEFECTIVE SINGLE PRINTED CIRCUIT BOARD OF THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS USING THE SAME 有权
    阵列印刷电路板,替代其有缺陷的单列印刷电路板的方法以及使用其制造电子设备的方法

    公开(公告)号:US20150075844A1

    公开(公告)日:2015-03-19

    申请号:US14458249

    申请日:2014-08-12

    Abstract: An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB.

    Abstract translation: 提供阵列印刷电路板(PCB),其中可以容易地更换有缺陷的单个PCB。 还提供了更换有缺陷的单个PCB的方法和制造电子设备的方法。 阵列PCB可以包括多个单个PCB。 轨道部分可以围绕单个PCB。 多个翼片路线部分将单个PCB连接到轨道部分,每个翼片路线部分包括至少一对通孔电极。 测试端子部分可以形成在轨道部分的一侧,并且可以包括多个测试端子。 所述至少一对通孔电极可以包括邻近所述轨道部分设置并电连接到相应测试端子的第一通孔电极,以及邻近并电连接到相应的单个PCB布置的第二通孔电极。

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