Apparatus for controlling hydraulic fluid pressure
    1.
    发明授权
    Apparatus for controlling hydraulic fluid pressure 失效
    用于控制液压油压力的装置

    公开(公告)号:US06308725B1

    公开(公告)日:2001-10-30

    申请号:US09480354

    申请日:2000-06-10

    IPC分类号: G05D1620

    摘要: A smart actuator (10), includes a mounting base (12), a solenoid element (14), and a pressure sensor element (16). The solenoid element (14) and the pressure sensor element (16) are in electrical communication with a remote control element (17) through a wire harness (18). The remote control element (17) sends a signal to the solenoid element (14) to adjust hydraulic fluid pressure. The pressure sensor (16) reports back to the remote control element (17) the value of hydraulic fluid pressure such that a closed-loop system in formed where correct hydraulic fluid pressure is rapidly and accurately attained.

    摘要翻译: 智能致动器(10)包括安装基座(12),螺线管元件(14)和压力传感器元件(16)。 螺线管元件(14)和压力传感器元件(16)通过线束(18)与遥控元件(17)电连通。 遥控元件(17)向螺线管元件(14)发送信号以调节液压流体压力。 压力传感器(16)向遥控元件(17)报告液压流体压力的值,使得形成在正确的液压流体压力快速准确地达到的闭环系统。

    High density wirebond connector assembly
    2.
    发明授权
    High density wirebond connector assembly 有权
    高密度导线接头组件

    公开(公告)号:US06309224B1

    公开(公告)日:2001-10-30

    申请号:US09467502

    申请日:1999-12-20

    IPC分类号: H01R1200

    摘要: A high density wirebond connector assembly (10), including an enclosure (12), a circuit board (14), a high density connector (16), a connector housing (18), and a plurality of nail contacts (20). The circuit board (14) is comprised of a plurality of laminate layers (26) and rows of wirebond pads (28) positioned on the laminate layers (26). A plurality of wirebonds (32) run between individual nail contacts (20) and individual wirebond pads (28). By increasing the density of the high density connector (16), and decreasing the distance between the wirebond pads (28) and the nail contacts (20), a smaller, lighter, cheaper, and vibrationally resistant high density connector assembly (10) is provided.

    摘要翻译: 包括外壳(12),电路板(14),高密度连接器(16),连接器壳体(18)和多个指甲触点(20)的高密度导线接头组件(10)。 电路板(14)由位于层叠层(26)上的多个层叠层(26)和排焊垫(28)组成。 多个线圈(32)在各个指甲触点(20)和单独的引线键合垫(28)之间延伸。 通过增加高密度连接器(16)的密度,并且减小引线键合垫(28)和指甲触点(20)之间的距离,较小,较轻,便宜且抗振动的高密度连接器组件(10)是 提供。

    Apparatus for dampening movement of passivation material in an
electronic module
    3.
    发明授权
    Apparatus for dampening movement of passivation material in an electronic module 失效
    用于抑制电子模块中钝化材料运动的装置

    公开(公告)号:US5895883A

    公开(公告)日:1999-04-20

    申请号:US908019

    申请日:1997-08-11

    IPC分类号: H05K5/00 H05K7/14

    CPC分类号: H05K5/0047 H05K7/142

    摘要: An apparatus for dampening movement of passivation material in an electronic module and a method for manufacturing an electronic module incorporating such an apparatus are disclosed. The apparatus includes a housing defining a cavity sized to contain an electrical circuit and a non-solid passivation material. The apparatus further includes means for limiting movement of the passivation material within the cavity in at least one direction. In a preferred embodiment, the limiting means comprises at least one dam.

    摘要翻译: 公开了一种用于抑制电子模块中的钝化材料的移动的装置和用于制造包含这种装置的电子模块的方法。 该装置包括壳体,其限定尺寸适于容纳电路和非固体钝化材料的腔。 该装置还包括用于限制钝化材料在空腔内沿至少一个方向移动的装置。 在优选实施例中,限制装置包括至少一个坝。