公开(公告)号：US20120243155A1

公开(公告)日：2012-09-27

申请号：US13009922

申请日：2011-01-20

申请人： Luis J. Matienzo ,  Norman A. Card ,  Daniel C. VanHart ,  John J. Konrad ,  Frank D. Egitto ,  Rabindra N. Das

发明人： Luis J. Matienzo ,  Norman A. Card ,  Daniel C. VanHart ,  John J. Konrad ,  Frank D. Egitto ,  Rabindra N. Das

IPC分类号： H05K7/14 ,  H01L21/50

CPC分类号： H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of forming a circuitized substrate utilizing a conductive nub structure for enhanced interconnection integrity by using a joining core layer with copper outer layer on it, and forming thru-holes in the joining layer. Placing conductive adhesive in the thru-hole prior to removing the copper outer layers from the joining core layer creates an adhesive bump on joining core layer that engages a conductive secondary metal nub placed on the circuitized substrate-to-joining layer contact points, thus creating an enhanced connection between the layers.

摘要翻译： 通过使用其上具有铜外层的接合芯层和在接合层中形成通孔来形成利用导电嵌入结构的电路化衬底以增强互连完整性的方法。 在从接合芯层去除铜外层之前，将导电粘合剂放置在通孔中，在接合芯层上形成粘合凸块，该粘合凸块与放置在电路化的基底 - 接合层接触点上的导电二次金属复合体接合，从而产生 层之间的增强连接。