公开(公告)号：US06558562B2

公开(公告)日：2003-05-06

申请号：US09948836

申请日：2001-09-07

申请人： Daniel S. Mallery ,  Doug Kreager ,  Chris E. Barns

发明人： Daniel S. Mallery ,  Doug Kreager ,  Chris E. Barns

IPC分类号： B44C122

CPC分类号： H01L21/68707 ,  G11B23/00

摘要： A wafer handling wand allows the efficient loading and unloading of semiconductor wafers to and from a CMP apparatus. The wand includes identical work piece gripping, alignment, and loading/unloading mechanisms on the top and bottom sides. A processed wafer can be unloaded from the apparatus onto one side of the wand and an unprocessed wafer can be loaded into the apparatus from the second side. The gripping mechanism includes a support area and a spaced apart moveable gripping finger. Wafer loading is facilitated by a cam attached to the support area that rotates when the cam contacts the apparatus. Upon rotation, the cam provides a surface for directing the work piece into the apparatus. The surface of the cam also includes an alignment aid that can be brought into contact with a reference surface on the apparatus to insure proper alignment between the wand and the apparatus.

公开(公告)号：US06746318B2

公开(公告)日：2004-06-08

申请号：US09975450

申请日：2001-10-11

申请人： Daniel S. Mallery ,  Sean S. Logan ,  James F. Lee

发明人： Daniel S. Mallery ,  Sean S. Logan ,  James F. Lee

IPC分类号： B24B500

CPC分类号： H01L21/6838 ,  B24B37/30 ,  B24B37/32 ,  B24B49/16 ,  H01L21/67253

摘要： A carrier with adjustable pressure zones and adjustable barriers between zones for distributing the pressure on the backside of a wafer. The pressure zones may be created using an elastic web diaphragm. One or more grooves are formed in the surface of the diaphragm to relieve vacuum formed between the diaphragm and wafer.

摘要翻译： 具有可调节压力区域和区域之间可调节隔板的载体，用于在晶片的背面分配压力。 可以使用弹性腹板隔膜来产生压力区域。 在隔膜的表面中形成一个或多个凹槽以减轻隔膜和晶片之间形成的真空。