公开(公告)号：US20070284731A1

公开(公告)日：2007-12-13

申请号：US11724188

申请日：2007-03-15

申请人： Takashi Atsumi ,  Junzo Ukai ,  Kenji Eto ,  Kenji Nakamura ,  Sezto Daiza ,  Paul Arthur Meloni ,  Attignal N. Sreeram ,  Kurt Douglas Roberts ,  David Leroy Sutton

发明人： Takashi Atsumi ,  Junzo Ukai ,  Kenji Eto ,  Kenji Nakamura ,  Sezto Daiza ,  Paul Arthur Meloni ,  Attignal N. Sreeram ,  Kurt Douglas Roberts ,  David Leroy Sutton

IPC分类号： H01L23/36

CPC分类号： H01L23/3737 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/00

摘要： The mounting structure of a power device is simplified so as to reduce cost while achieving improvements in heat dissipation and reliability. A power module 100 is comprised of a metal wiring board 13, a power device 11 disposed on an upper surface of the metal wiring board 13 via a solder layer 12, a metal heat dissipating plate 15 disposed on a lower surface of the metal wiring board 13, and a heat sink 19 disposed on a lower surface of the metal heat dissipating plate 15. A resin-based insulating layer 14 is disposed between any desired two of the aforementioned layers.

摘要翻译： 功率器件的安装结构简化，从而降低成本，同时实现散热和可靠性的提高。 功率模块100包括金属布线板13，经由焊料层12配置在金属布线基板13的上表面的电力装置11，配置在金属布线基板13的下表面的金属散热板15 13和设置在金属散热板15的下表面上的散热器19.树脂基绝缘层14设置在任何所需的两个上述层之间。