PVD sputter system having nonplanar target configuration and methods for
constructing same
    1.
    发明授权
    PVD sputter system having nonplanar target configuration and methods for constructing same 失效
    具有非平面靶构造的PVD溅射系统及其构造方法

    公开(公告)号:US5580428A

    公开(公告)日:1996-12-03

    申请号:US457856

    申请日:1995-06-01

    IPC分类号: C23C14/34

    CPC分类号: C23C14/3407

    摘要: A PVD sputter system having a nonplanar target surface is disclosed. The configuration of the nonplanar target surface is adjusted to provide improved uniformity in deposition film thickness and step coverage at the peripheral boundary regions of the substrate. Emission-inducing power is distributed independently to different portions of the nonplanar target surface so as to modify the deposition profile according to substrate size and other factors.

    摘要翻译: 公开了一种具有非平面靶表面的PVD溅射系统。 调整非平面目标表面的配置,以提供在衬底的周边边界区域的沉积膜厚度和台阶覆盖率的改善的均匀性。 发射诱导功率独立地分布到非平面目标表面的不同部分,以便根据衬底尺寸和其他因素改变沉积轮廓。

    Multiple tier collimator system for enhanced step coverage and uniformity
    2.
    发明授权
    Multiple tier collimator system for enhanced step coverage and uniformity 失效
    多级准直器系统,增强了台阶覆盖和均匀性

    公开(公告)号:US5643428A

    公开(公告)日:1997-07-01

    申请号:US382366

    申请日:1995-02-01

    IPC分类号: H01J37/34 C23C14/34

    CPC分类号: H01J37/3447 H01J37/34

    摘要: A collimator system for use in PVD sputtering of semiconductor wafers having multiple tiers provided between a target and wafer substrate. The collimator system prevents target atoms from contacting the wafer at substantially oblique angles, thereby providing good step coverage uniformity over the surface of the wafer. Additionally, the presence of more than one tier prevents localized build-up of target atoms that occurs in conventional single tier collimators, thereby providing good flat coverage uniformity over the surface of the wafer.

    摘要翻译: 一种用于半导体晶片的PVD溅射的准直器系统,其具有设置在靶和晶片衬底之间的多层。 准直器系统防止目标原子以基本倾斜的角度接触晶片,从而在晶片的表面上提供良好的阶梯覆盖均匀性。 另外,存在多于一层防止在常规单层准直仪中发生的目标原子的局部积累,从而在晶片的表面上提供良好的平坦覆盖均匀性。

    PVD sputter system having nonplanar target configuration and methods for
operating same
    3.
    发明授权
    PVD sputter system having nonplanar target configuration and methods for operating same 失效
    具有非平面目标配置的PVD溅射系统及其操作方法

    公开(公告)号:US5556525A

    公开(公告)日:1996-09-17

    申请号:US316090

    申请日:1994-09-30

    IPC分类号: C23C14/34

    CPC分类号: C23C14/3407

    摘要: A PVD sputter system having a nonplanar target surface is disclosed. The configuration of the nonplanar target surface is adjusted to provide improved uniformity in deposition film thickness and step coverage at the peripheral boundary regions of the substrate. Emission-inducing power is distributed independently to different portions of the nonplanar target surface so as to modify the deposition profile according to substrate size and other factors.

    摘要翻译: 公开了一种具有非平面靶表面的PVD溅射系统。 调整非平面目标表面的配置,以提供在衬底的周边边界区域的沉积膜厚度和台阶覆盖率的改善的均匀性。 发射诱导功率独立地分布到非平面目标表面的不同部分,以便根据衬底尺寸和其他因素改变沉积轮廓。