公开(公告)号：US20110222965A1

公开(公告)日：2011-09-15

申请号：US13034439

申请日：2011-02-24

申请人： Dennis Copp

发明人： Dennis Copp

IPC分类号： E01C7/20 ,  E01C7/35

CPC分类号： E01C7/187 ,  E01C7/353

摘要： This invention relates to a method for chip seal coating. Aggregate is pre-coated, at ambient temperature, with an emulsion. The pre-coated aggregate is then allowed to sit, preferably for at least 24 hours, to allow the mixture to break into the asphalt and soapy water components of the mixture. The aggregate is then air dried to a moisture content of between 1 percent minimum to a maximum of 15 percent. A paved surface may be manufactured by first apply hot asphalt binder to a properly prepared base. The pre-coated aggregate is then spread on top of the binder. Using a roller, the aggregate is embedded into the binder and compacted.

摘要翻译： 本发明涉及一种切屑密封涂覆方法。 聚合物在环境温度下用乳液预涂覆。 然后将预先涂覆的骨料置于优选至少24小时，以允许混合物分解成混合物的沥青和肥皂水组分。 然后将骨料空气干燥至1％至最高15％的水分含量。 可以通过首先将热沥青粘合剂施加到适当制备的基底上来制造铺设的表面。 然后将预涂层的聚集体铺在粘合剂的顶部。 使用辊子，将骨料嵌入粘合剂中并压实。