公开(公告)号：US5641364A

公开(公告)日：1997-06-24

申请号：US549319

申请日：1995-10-27

申请人： Dmitrii Victorovich Golberg ,  Kazuhiro Otsuka ,  Tatsuhiko Ueki ,  Hiroshi Horikawa ,  Kengo Mitose

发明人： Dmitrii Victorovich Golberg ,  Kazuhiro Otsuka ,  Tatsuhiko Ueki ,  Hiroshi Horikawa ,  Kengo Mitose

IPC分类号： C22F1/00 ,  C22C1/02 ,  C22F1/16

CPC分类号： C22F1/006

摘要： A method of manufacturing a high-temperature shape memory alloy includes the steps of cold-working a high-temperature shape memory alloy, in which a reverse martensite transformation start temperature (As) in a first heating after cold working reaches 350.degree. C. or above. Thereafter, the cold-worked alloy undergoes a first heat treatment for a period of time within the incubation time required for recrystallization or less, and at a temperature higher than a reverse martensite transformation finish temperature (Af). Finally, the resultant alloy is annealed with a second heat treatment, at a temperature which is not less than the plastic strain recovery temperature and not more than the recrystallization temperature. Specifically, the first heat treatment is performed for a period of three minutes or less at a temperature which exceeds 500.degree. C. and which is lower than the melting point of the alloy. The composition of the high-temperature shape memory alloy is Ti.sub.50 Ni.sub.50-x Pd.sub.x (x being 35 to 50 at %), Ti.sub.50-x Ni.sub.50 Zr.sub.x (x being 22 to 30 at %), Ti.sub.50-x Ni.sub.50 Hf.sub.x (x being 20 to 30 at %) or the like.

摘要翻译： 制造高温形状记忆合金的方法包括冷加工高温形状记忆合金的步骤，其中冷加工后第一加热中的反向马氏体转变开始温度（As）达到350℃，或 以上。 此后，冷加工合金在再结晶所需的温育时间以下，以及高于反马氏体转变终止温度（Af）的温度下进行一段时间的第一次热处理。 最后，在不低于塑性应变恢复温度且不大于再结晶温度的温度下，将所得合金进行第二次热处理退火。 具体而言，在超过500℃，低于合金的熔点的温度下进行第1次热处理3分钟以下。 高温形状记忆合金的组成为Ti50Ni50-xPdx（x为35〜50原子％），Ti50-xNi50Zrx（x为22〜30原子％），Ti50-xNi50Hfx（x为20〜30原子％）或 类似。