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公开(公告)号：US20120291938A1
公开(公告)日：2012-11-22
申请号：US13548674
申请日：2012-07-13
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： B29C65/52
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
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公开(公告)号：US08771442B2
公开(公告)日：2014-07-08
申请号：US13548674
申请日：2012-07-13
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： C08L65/00 , C09J123/00 , B32B37/00 , C08G77/14 , C08G73/10
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
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公开(公告)号：US08221571B2
公开(公告)日：2012-07-17
申请号：US12969367
申请日：2010-12-15
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
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公开(公告)号：US08092628B2
公开(公告)日：2012-01-10
申请号：US12263120
申请日：2008-10-31
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： B32B37/00
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
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公开(公告)号：US20110086955A1
公开(公告)日：2011-04-14
申请号：US12969367
申请日：2010-12-15
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
IPC分类号： C08K5/5393 , C09J147/00
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
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公开(公告)号：US20100112305A1
公开(公告)日：2010-05-06
申请号：US12263120
申请日：2008-10-31
申请人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
发明人： Wenbin Hong , Dongshun Bai , Tony D. Flaim , Rama Puligadda
CPC分类号： H01L21/187 , C08G2261/332 , C08G2261/418 , C08L65/00 , C09J123/0823 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/10 , Y10T156/1153 , Y10T428/24355 , Y10T428/24802
摘要： New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a cycloolefin copolymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened or dissolved to allow the wafers to slide or be pulled apart at the appropriate stage in the fabrication process.
摘要翻译： 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物包含分散或溶解在溶剂体系中的环烯烃共聚物，并且可用于将活性晶片结合到载体晶片或基底，以在随后的处理和处理期间有助于保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化或溶解以允许晶片在制造过程中的适当阶段滑动或拉开。
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