公开(公告)号：US20080064266A1

公开(公告)日：2008-03-13

申请号：US11531014

申请日：2006-09-12

申请人： David GIVENS ,  John HYNES ,  Douglas E. McCARTIN ,  Douglas M. WATHEN

发明人： David GIVENS ,  John HYNES ,  Douglas E. McCARTIN ,  Douglas M. WATHEN

IPC分类号： H01R24/00

CPC分类号： H01R12/57 ,  H01R13/506 ,  H01R24/64 ,  H01R43/22

摘要： A modular jack includes a housing having a socket and an opening arranged to receive a modular plug into the socket, and a sled including a contact array arranged within the socket, wherein the sled is removable from the socket through the opening of the housing without disassembling the housing.