公开(公告)号：US06753039B2

公开(公告)日：2004-06-22

申请号：US10211029

申请日：2002-08-02

Applicant: Robert L. Heimann ,  Branko Popov ,  Dragan Slavkov ,  Bala Haran

Inventor： Robert L. Heimann ,  Branko Popov ,  Dragan Slavkov ,  Bala Haran

IPC: B05D302

CPC classification number: C23C22/62 ,  C23C22/60

Abstract: The disclosure relates to an electroless or electrolytic process for treating metallic surfaces. The process employs a medium comprising at least one oxygen containing water soluble compound (e.g., stannates, molybdates, vanadates and hydrated cerium compounds) having a controlled and predetermined concentration, temperature and pH wherein the metallic surface is at least partially corroded or solubilized.

Abstract translation: 本公开涉及用于处理金属表面的无电解或电解方法。 该方法采用包含至少一种具有受控和预定浓度，温度和pH的至少一种含氧水溶性化合物（例如，锡酸盐，钼酸盐，钒酸盐和水合铈化合物）的介质，其中金属表面至少部分被腐蚀或溶解。

公开(公告)号：US06761934B2

公开(公告)日：2004-07-13

申请号：US10211051

申请日：2002-08-02

Applicant: Robert L. Heimann ,  Brank Popov ,  Bruce Flint ,  Dragan Slavkov ,  Craig Bishop

Inventor： Robert L. Heimann ,  Brank Popov ,  Bruce Flint ,  Dragan Slavkov ,  Craig Bishop

IPC: B05D118

CPC classification number: C09D1/02 ,  C04B28/26 ,  C04B2111/00525 ,  C04B2111/1012 ,  C04B2111/1075 ,  C04B2111/94 ,  C23C22/60 ,  C23C22/62 ,  Y10T428/12 ,  Y10T428/12611 ,  Y10T428/12792 ,  Y10T428/12799 ,  Y10T428/29 ,  C04B14/062 ,  C04B22/04 ,  C04B41/5089 ,  C04B2103/0094 ,  C04B22/08 ,  C04B41/48 ,  C04B2103/0025

Abstract: The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electroless process to deposit a silicate containing coating or film upon a metallic or conductive surface.

Abstract translation: 本公开涉及在金属或导电表面的表面上形成沉积物的方法。 该方法采用无电解方法将含硅酸盐的涂层或膜沉积在金属或导电表面上。