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公开(公告)号：US11474640B2
公开(公告)日：2022-10-18
申请号：US17335554
申请日：2021-06-01
发明人： Chin-Fu Chang , Shang-Tai Yeh
摘要： A touch sensitive processing method for reducing interference from pixel refresh, comprising: sensing horizontal electrodes of a touch screen three times for gathering three sensing values, the sensing steps are separated by a time period; summing the three sensing values as sums; according to the sums, determining an external conductive object is disposed near a N-th horizontal electrode among the horizontal electrode of the touch screen; emitting driving signal from the N-th horizontal electrode and sensing the driving signal via vertical electrodes of the touch screen for gathering an N-th sensing array; and calculating a position of a touch event according to the N-th sensing array and the position of the N-th horizontal electrode.
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公开(公告)号：US20220308731A1
公开(公告)日：2022-09-29
申请号：US17701731
申请日：2022-03-23
发明人： CHIN-FU CHANG , SHANG-TAI YEH
摘要： A touch sensitive processing method comprising: sensing a first characteristic value of the electrical signals received in a reference signal time period; sensing a second characteristic value of the electrical signals, having a first number of waves, received in a first modulation signal time period; sensing a third characteristic value of the electrical signals, having a second number of waves, received in a second modulation signal time period; calculating a first ratio of the second characteristic value and the first characteristic value and calculating a second ratio of the third characteristic value and first characteristic value; and calculating the signal value according to a function of the first ratio, the second ratio, the first number of waves and the second number of waves.
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3.发明授权公开(公告)号：US11435852B2
公开(公告)日：2022-09-06
申请号：US17559016
申请日：2021-12-22
发明人： Chin-Fu Chang , Shang-Tai Yeh
摘要： A touch sensitive processing method, comprising: generating modified codes of N orthogonal pseudo random number (PN) codes, each of PN code has M symbols, where M and N are positive integers larger than 1; transmitting driving signals modulated by the N modified codes via N first electrodes, respectively, and sensing via multiple second electrodes in a M symbols period to generate M one-dimensional sensing information arrays; calculating sums of corresponding elements of the M one-dimensional sensing information arrays corresponding to each of the second electrodes, respectively; determining whether each of the sums is in a range; and recording the M one-dimensional sensing information arrays and their corresponding N first electrodes and N PN codes in response to that at least one of the sums is determined out of the range.
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公开(公告)号：US11379073B2
公开(公告)日：2022-07-05
申请号：US17399291
申请日：2021-08-11
发明人： Chin-Fu Chang
IPC分类号： G06F3/041 , H04L67/025 , G06F3/04847
摘要： An apparatus is provided for remote monitoring a first apparatus. The first apparatus comprises a touch screen, a touch sensitive module being coupled to the touch screen, a first network module being connected to a network, and a first processing module. The apparatus comprising: a second network module, configured to connect to the network; and a second processing module, configured to execute a second program stored in a non-volatile memory for realizing following steps: transmitting a setting parameter to the first apparatus via the second network module, wherein the first processing module is configured for receiving the setting parameter of the touch sensitive module from the first network module, commanding the touch sensitive module to use the setting parameter to get touch sensitive information corresponding to the touch screen, and receiving the touch sensitive information from the touch sensitive module and transmitting the touch sensitive information to the apparatus; and receiving the touch sensitive information from the first apparatus via the second network module.
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公开(公告)号：US11367710B2
公开(公告)日：2022-06-21
申请号：US17034161
申请日：2020-09-28
发明人： Po-Chuan Lin
IPC分类号： H01L23/00 , H01L25/065 , H01L23/498
摘要： A multi-chip package structure includes outer leads, a first chip and a second chip. The outer leads are disposed on four sides of a chip bonding area of a package carrier thereof, respectively. The first chip is fixed on the chip bonding area and includes a core and a seal ring. Input/output units, and first bonding pads are disposed, in an outward order, on the sides of the core. Each first bonding pad is electrically connected to a corresponding outer lead through a first wire. Dummy pads are disposed between the input/output units and the at least one side of the core. The second chip is stacked on the core and includes second bonding pads connected to the corresponding outer leads through second wires and dummy pads, so as to prevent from short circuit caused by soldering overlap and contact between the wires.
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公开(公告)号：US20220035462A1
公开(公告)日：2022-02-03
申请号：US17504958
申请日：2021-10-19
发明人： CHIN-FU CHANG , SHANG-TAI YEH
IPC分类号： G06F3/038 , H04B1/02 , G06F3/0354 , G06F3/041 , G06F3/044
摘要： The present application provides a transmitter including a first sensor and a processing module electrically coupled to the first sensor. The processing module is configured to transmit a first electric signal during a first time period. The first electric signal represents at least one part of a digital sensing value of the first sensor.
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公开(公告)号：US11237648B2
公开(公告)日：2022-02-01
申请号：US16846763
申请日：2020-04-13
发明人： Chin-Fu Chang , Shang-Tai Yeh
IPC分类号： G06F3/038 , G06F3/0354 , G06F3/041 , G06F3/044
摘要： The present application provides a touch sensitive processing method for a tethered stylus. The method comprises selectively driving two of three circuit components of the stylus in three shorter time periods, sensing induced signals from electrodes of a touch panel, and calculating coordinates of a tip electrode and a surrounding electrode of the stylus accordingly.
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公开(公告)号：US20220028851A1
公开(公告)日：2022-01-27
申请号：US17034221
申请日：2020-09-28
发明人： Po-Chuan LIN
摘要： Multichip package manufacturing process is disclosed to form external pins at one side or each side of die-bonding area of package carrier board and to bond first IC and second IC to die-bonding area in stack. First IC and second IC each comprise transistor layer with core circuits, plurality of metal layers, plurality of VIA layers and solder pad layer. During production of first IC, design of at least one metal layer, VIA layer and dummy pads can be modified according to change of design of second IC. After chip probing, die sawing and bonding, wire bonding, packaging and final test are performed to package the package carrier board, first IC and second IC into automotive multichip package, achieving purpose of first IC only need to modify at least one layer or more than one layer to cooperate with second IC design change to carry out multichip packaging process.
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公开(公告)号：US20210397344A1
公开(公告)日：2021-12-23
申请号：US17350193
申请日：2021-06-17
发明人： SHUN-LUNG HO
摘要： A touch sensitive processing method applicable to a touch panel is provided. The touch panel includes sequentially a third electrode layer, a flexible dielectric layer, and at least one touch electrode layer. The third electrode layer includes multiple parallel third electrodes. The at least one touch electrode layer includes first electrodes in parallel to a first axis and second electrodes in parallel to a second axis. Each of the first electrodes intersects with the second electrodes to form multiple intersections. The touch sensitive processing method comprises: performing self-capacitance detection via the third electrodes to retrieve an approximating event, performing mutual-capacitance detection via the first electrodes and the second electrodes to retrieve a touching event, and reporting the approximating event to a host if the touching event is detected, or reporting the touching event if it is detected.
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10.发明申请公开(公告)号：US20210382568A1
公开(公告)日：2021-12-09
申请号：US17407507
申请日：2021-08-20
发明人： SHANG-TAI YEH
IPC分类号： G06F3/0354 , G06F3/038 , G06F1/3231 , G06F1/3234 , G06F3/041 , G06F3/039
摘要： The present invention provides a touch sensitive processing apparatus for detecting an electronic board eraser. The touch sensitive processing apparatus connects to a touch panel. The touch panel includes parallel first electrodes and parallel second electrodes, each of the first electrodes intersects with the second electrodes to form multiple intersection areas. The touch sensitive processing apparatus includes: a driving circuit connecting to the first electrodes; a sensing circuit connecting to the first electrodes and the second electrodes; and a processor connecting to the driving circuit and the sensing circuit. Wherein the processor is configured to execute a program module for realizing the following steps: having the driving circuit emit a beacon signal via the first electrodes simultaneously; and having the sensing circuit detect electrical signal emitted from at least three eraser electrodes of the electronic board eraser via the first and the second electrodes after a time period since the beacon signal is emitted.
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