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公开(公告)号:US20100155935A1
公开(公告)日:2010-06-24
申请号:US12317447
申请日:2008-12-23
申请人: Ed Prack , Leonel Arana , Sandeep Razdan
发明人: Ed Prack , Leonel Arana , Sandeep Razdan
CPC分类号: C23C16/26 , C23C14/0605 , C23C14/46 , H01L23/29 , H01L2924/0002 , H01L2924/00
摘要: Methods for coating a protective material on a semiconductor substrate to protect a back surface thereof from defects are provided, by depositing a diamond-like coating (DLC) material thereon at a low temperature, e.g. between about 150° C. to about 350° C.
摘要翻译: 在半导体衬底上涂覆保护材料以保护其背面免受缺陷的方法是通过在低温下沉积类金刚石涂层(DLC)材料来实现的。 约150℃至约350℃
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公开(公告)号:US08138239B2
公开(公告)日:2012-03-20
申请号:US12342322
申请日:2008-12-23
IPC分类号: C08K7/16
CPC分类号: C08K9/04 , Y10T428/25 , Y10T428/254
摘要: In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.
摘要翻译: 在一些实施例中,呈现聚合物热界面材料。 在这方面,引入热界面材料,其包括聚合物基质,基质添加剂,其中基质添加剂包括助熔剂和球形填料,其中球形填料材料包括具有有机可焊性防腐涂层的金属芯。 还公开并要求保护其他实施例。
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公开(公告)号:US20100159233A1
公开(公告)日:2010-06-24
申请号:US12342322
申请日:2008-12-23
IPC分类号: B32B5/16
CPC分类号: C08K9/04 , Y10T428/25 , Y10T428/254
摘要: In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.
摘要翻译: 在一些实施例中,呈现聚合物热界面材料。 在这方面,引入热界面材料,其包括聚合物基质,基质添加剂,其中基质添加剂包括助熔剂和球形填料,其中球形填料材料包括具有有机可焊性防腐涂层的金属芯。 还公开并要求保护其他实施例。
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