Polymer thermal interface materials
    2.
    发明授权
    Polymer thermal interface materials 有权
    聚合物热界面材料

    公开(公告)号:US08138239B2

    公开(公告)日:2012-03-20

    申请号:US12342322

    申请日:2008-12-23

    申请人: Ed Prack Yi Li Wei Wu

    发明人: Ed Prack Yi Li Wei Wu

    IPC分类号: C08K7/16

    摘要: In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.

    摘要翻译: 在一些实施例中,呈现聚合物热界面材料。 在这方面,引入热界面材料,其包括聚合物基质,基质添加剂,其中基质添加剂包括助熔剂和球形填料,其中球形填料材料包括具有有机可焊性防腐涂层的金属芯。 还公开并要求保护其他实施例。

    POLYMER THERMAL INTERFACE MATERIALS
    3.
    发明申请
    POLYMER THERMAL INTERFACE MATERIALS 有权
    聚合物热界面材料

    公开(公告)号:US20100159233A1

    公开(公告)日:2010-06-24

    申请号:US12342322

    申请日:2008-12-23

    申请人: Ed Prack Yi Li

    发明人: Ed Prack Yi Li

    IPC分类号: B32B5/16

    摘要: In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.

    摘要翻译: 在一些实施例中,呈现聚合物热界面材料。 在这方面,引入热界面材料,其包括聚合物基质,基质添加剂,其中基质添加剂包括助熔剂和球形填料,其中球形填料材料包括具有有机可焊性防腐涂层的金属芯。 还公开并要求保护其他实施例。