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1.发明申请公开(公告)号：US20130319727A1
公开(公告)日：2013-12-05
申请号：US13561598
申请日：2012-07-30
Applicant: ED WEN , ADAM SCOTT EHRMANTRAUT , JAMES MCDANIEL SNIDER, II , ROBERT PARKS
Inventor： ED WEN , ADAM SCOTT EHRMANTRAUT , JAMES MCDANIEL SNIDER, II , ROBERT PARKS
CPC classification number: B64C3/20 , B64C3/185 , B64C3/26 , B64D45/00 , B64D2221/00 , H01B7/08 , Y10T156/10
Abstract: An aircraft conductor sandwich assembly configured to be embedded in a composite aircraft structure. The conductor sandwich assembly comprises a plurality of carbon conductors disposed between two sheets of insulating layers and an adhesive resin bonding the plurality of carbon conductors and the two sheets of insulating layers into a carbon sandwich assembly such that (i) the conductors are electrically isolated and (ii) structural loads can be passed through said conductor sandwich assembly.
Abstract translation: 配置成嵌入在复合飞机结构中的飞机导体夹层组件。 导体夹层组件包括设置在两片绝缘层之间的多个碳导体和将多个碳导体和两片绝缘层粘合成碳夹层组件的粘合剂树脂，使得（i）导体是电隔离的，并且 （ii）结构载荷可以通过所述导体夹层组件。
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2.发明授权Apparatus and method for an aircraft conductor sandwich assembly embedded to an aircraft structure 有权飞机导体夹层组件的嵌入式飞机结构的装置和方法公开(公告)号：US08937254B2
公开(公告)日：2015-01-20
申请号：US13561598
申请日：2012-07-30
Applicant: Ed Wen , Adam Scott Ehrmantraut , James McDaniel Snider, II , Robert Parks
Inventor： Ed Wen , Adam Scott Ehrmantraut , James McDaniel Snider, II , Robert Parks
CPC classification number: B64C3/20 , B64C3/185 , B64C3/26 , B64D45/00 , B64D2221/00 , H01B7/08 , Y10T156/10
Abstract: An aircraft conductor sandwich assembly configured to be embedded in a composite aircraft structure. The conductor sandwich assembly comprises a plurality of carbon conductors disposed between two sheets of insulating layers and an adhesive resin bonding the plurality of carbon conductors and the two sheets of insulating layers into a carbon sandwich assembly such that (i) the conductors are electrically isolated and (ii) structural loads can be passed through said conductor sandwich assembly.
Abstract translation: 配置成嵌入在复合飞机结构中的飞机导体夹层组件。 导体夹层组件包括设置在两片绝缘层之间的多个碳导体和将多个碳导体和两片绝缘层粘合成碳夹层组件的粘合剂树脂，使得（i）导体是电隔离的，并且 （ii）结构载荷可以通过所述导体夹层组件。
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