公开(公告)号：US5958594A

公开(公告)日：1999-09-28

申请号：US923531

申请日：1997-09-04

申请人： Naokatsu Hisanaga ,  Kenji Ueda ,  Kenji Ishii ,  Eiji Tsunematsu ,  Susumu Kusakawa ,  Takashi Hamaguchi ,  Masaya Itoh ,  Yoshitsugu Morimoto

发明人： Naokatsu Hisanaga ,  Kenji Ueda ,  Kenji Ishii ,  Eiji Tsunematsu ,  Susumu Kusakawa ,  Takashi Hamaguchi ,  Masaya Itoh ,  Yoshitsugu Morimoto

IPC分类号： C08G18/42 ,  C08G18/36 ,  C08G18/62 ,  C08G18/67 ,  C08G18/69 ,  H01B3/30 ,  B32B27/40 ,  C08L75/00

CPC分类号： C08G18/36 ,  C08G18/6208 ,  C08G2190/00 ,  Y10T428/31551 ,  Y10T428/31609

摘要： A urethane-forming curable composition which has a low viscosity and therefore can sufficiently flow around to details or minute cavities of electric or electronic parts or devices to seal the same and which can give flexible curing products excellent in heat resistance, hydrolysis resistance (wet heat resistance) and moistureproofness and capable of preventing hardness changes as well as reductions in insulating performance over a long period of time even under severe conditions and therefore can reliably protect the electric or electronic parts or devices. A hydrogenated OH-containing liquid polyisoprene (X) and a polyester polyol (Y) which is liquid at ordinary temperature and is constituted of fatty acid units (A) and polyhydric alcohol units (B) and which has an iodine value of not more than 50 are combinedly used as the polyol component. The fatty acid units (A) of this polyester polyol (Y) at least partly comprise hydroxy fatty acid oligomer (at least dimer) units (a). Electric or electronic parts or devices are treated for moistureproofness with the curing product of this urethane-forming curable composition.

摘要翻译： 一种氨基甲酸酯形成固化性组合物，其粘度低，因此可以充分流动到电子部件或电子部件或装置的细节或微小的空腔中以密封该组合物，并且可以提供耐热性，耐水解性（湿热 电阻）和防潮性，并且即使在恶劣的条件下也能够长时间地防止硬度变化以及绝缘性能的降低，因此可以可靠地保护电气或电子部件或装置。 常温下为液态的含氢OH的液体聚异戊二烯（X）和聚酯多元醇（Y），由脂肪酸单元（A）和多元醇单元（B）构成，碘值不大于 50作为多元醇成分组合使用。 该聚酯多元醇（Y）的脂肪酸单元（A）至少部分包含羟基脂肪酸低聚物（至少二聚体）单元（a）。 用这种氨基甲酸酯化固化性组合物的固化产物处理电气或电子部件或装置的防潮性。