Encapsulated Organic Electronic Device With Improved Resistance To Degradation
    1.
    发明申请
    Encapsulated Organic Electronic Device With Improved Resistance To Degradation 审中-公开
    具有改善抗降解性的封装有机电子器件

    公开(公告)号:US20090066244A1

    公开(公告)日:2009-03-12

    申请号:US12209176

    申请日:2008-09-11

    CPC classification number: H01L51/5203 H01L27/3281 H01L51/524

    Abstract: An encapsulated organic electronic device is provided with: a substrate; at least one first elementary component and one second elementary component set above the substrate, each of said first and second elementary components being provided with a respective first electrode set above the substrate, a respective region of organic material set above the first electrode, and a respective second electrode set above the region of organic material at least partially in an area corresponding to the first electrode; and an encapsulation structure, defining an encapsulation space isolated from an external environment and designed to protect the first and second elementary components from the external environment. In particular, the regions of organic material of the first and second elementary components are separated and distinct from one another and are set entirely within the encapsulation space.

    Abstract translation: 封装的有机电子器件设置有:衬底; 至少一个第一基本部件和一个第二基本部件,设置在所述基板上方,所述第一和第二基本部件中的每一个在基板上方设置有相应的第一电极组,设置在第一电极上方的有机材料的相应区域,以及 至少部分地在对应于第一电极的区域中的有机材料区域上方的相应的第二电极; 以及封装结构,其定义与外部环境隔离并且被设计为保护第一和第二基本组件免受外部环境的封装空间。 特别地,第一和第二基本部件的有机材料的区域彼此分离和分离,并且完全设置在封装空间内。

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