公开(公告)号：US08162199B2

公开(公告)日：2012-04-24

申请号：US12539893

申请日：2009-08-12

申请人： Eric E. Bourchard ,  Guy Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Jean-Luc Landreville

发明人： Eric E. Bourchard ,  Guy Brouillette ,  David H. Danovitch ,  Peter A. Gruber ,  Jean-Luc Landreville

IPC分类号： B23K3/00 ,  B41F15/44

CPC分类号： B23K3/08 ,  B23K2101/42

摘要： An apparatus for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided an apparatus for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.

摘要翻译： 一种用于去除在硅晶片上将焊料转移之前在注射模具的表面上遇到的多余焊料或污染物的装置。 更具体地，提供了一种用于去除可能存在于模具表面上的多余焊料的装置，而不去除位于模具中形成的空腔中的任何焊料，并且其中焊料通过注射成型焊接 处理。