摘要:
In high current integrated circuit wafer test applications, a high capacitance density capacitor may be formed in association with a probe card at a position closer to a wafer under test. This reduces the power path impedance, improving transient power delivery of a probe card. That is because now the capacitance is positioned more closely to the wafer under test, reducing path impedance. The capacitance density may be at higher, improving transient power delivery.
摘要:
A disk for a disk drive uses a circular platter having first and second sides and a circumferential edge. The circumferential edge of the disk has four symmetrically spaced apart shadows and a fifth or additional shadow that gives the disk an asymmetrical shadow signature. The fifth shadow is offset relative to the other shadows, which have congruent arcuate lengths and separation. The fifth shadow has an arcuate length that is about half as long as those of the other shadows, and is closely spaced adjacent to one of the other shadows. The asymmetric shadow signatures of the disk is used to precisely determine both the circumferential position of the platters and their planar orientation (i.e., A-side or B-side). For example, when the disk is mounted on a tool spindle and rotated, an optical detector detects the pattern of the shadows and feeds the data to a computer system. The rotational position of the spindle also is relayed to the computer for coordinating the processing of the rotating disk. When the disk is mounted on a different tool, the same shadow signature is used to determine its planar and angular positions.