公开(公告)号：US20230420910A1

公开(公告)日：2023-12-28

申请号：US18209008

申请日：2023-06-13

申请人： Sumitomo Electric Industries, Ltd. ,  FOUR TECHNOS Co., Ltd.

发明人： Munetaka KUROKAWA ,  Naoki FUJIWARA ,  Takehiko KIKUCHI ,  Kazuo KASAYA ,  Takeshi MARUYAMA

IPC分类号： H01S5/0236 ,  C04B37/00

CPC分类号： H01S5/0236 ,  C04B37/001 ,  H01S5/0201

摘要： A bonding device includes an irradiator that irradiates a surface of a first component with ultraviolet rays, and a conveyor that conveys the first component, wherein the irradiator irradiates the first component held by the conveyor with the ultraviolet ray, and the conveyor conveys the first component irradiated with the ultraviolet rays to a surface of a second component, and brings the surface of the first component and the surface of the second component into contact with each other to bond the first component and the second component.