公开(公告)号：US5862898A

公开(公告)日：1999-01-26

申请号：US823126

申请日：1997-03-25

Applicant: Fu-Cheng Chang

Inventor： Fu-Cheng Chang

IPC: A45C13/26 ,  A45C5/14

CPC classification number: A45C13/262 ,  Y10T16/473

Abstract: A retractable handle mounting structure includes two inner bars joined by a hand grip and moved with two sliding tracks in and out of two sleeves between a top frame and a wheeled bottom frame, two control blocks forced by a respective spring to lock the inner bars, and a control bar mounted in a hole at one end of the hand grip and supported on a spring at the bottom of one inner bar and depressed to force one control block out of engagement with the corresponding inner bar, and a linkage coupled between the control blocks, the linkage being actuated to pull both control blocks out of engagement with the inner bars upon depress of the control bar.

Abstract translation: 可伸缩手柄安装结构包括两个通过手柄连接的内杆，并且在顶框架和轮底底框架之间移动和移出两个滑动轨道的两个滑动轨道，两个控制块由相应的弹簧强制以锁定内杆， 以及控制杆，其安装在手柄的一端处的孔中并且被支撑在一个内杆的底部处的弹簧上并被压下以迫使一个控制块与相应的内杆不接合，以及联接在控制器 块，当所述控制杆按下时，所述连杆被致动以拉动所述控制块与所述内部杆的接合。

公开(公告)号：US5810132A

公开(公告)日：1998-09-22

申请号：US670063

申请日：1996-06-25

Applicant: Fu-Cheng Chang

Inventor： Fu-Cheng Chang

IPC: A45C13/26 ,  A45C5/14

CPC classification number: A45C13/262 ,  Y10T16/4554

Abstract: A retractable handle mounting arrangement includes a top frame, a bottom frame, a retractable handle connected between the top frame and the bottom frame and a press control device mounted in the top frame and forced springs to lock the inner bars of the retractable handle. The press control device includes two control blocks forced by springs into engagement with the inner bars of the retractable handle. A hand pulls the control block inwards, causing them to release the inner bars of the retractable handle, allowing the retractable handle to be extended.

Abstract translation: 可伸缩手柄安装装置包括顶框架，底框架，连接在顶框架和底框架之间的伸缩手柄和安装在顶框架中的压力控制装置和强制弹簧以锁定可伸缩手柄的内杆。 压力控制装置包括通过弹簧强制的与可伸缩手柄的内杆接合的两个控制块。 一只手将控制块向内拉，导致它们释放可伸缩手柄的内杆，从而可伸缩手柄延伸。

公开(公告)号：US20130178068A1

公开(公告)日：2013-07-11

申请号：US13346781

申请日：2012-01-10

Applicant: Chai Der YEN ,  Fu-Cheng CHANG ,  Cheng-Pang YEH ,  Hung-Yu CHIU ,  Hung-Che LIAO

Inventor： Chai Der YEN ,  Fu-Cheng CHANG ,  Cheng-Pang YEH ,  Hung-Yu CHIU ,  Hung-Che LIAO

IPC: H01L21/302 ,  G03F1/00

CPC classification number: H01L21/0274 ,  G03F1/50 ,  G03F1/54 ,  H01L21/31144 ,  H01L21/76807 ,  H01L21/76808 ,  H01L2221/1021

Abstract: A method comprising providing at least one dielectric layer above a semiconductor substrate, the at least one dielectric layer having a top surface and a bottom surface; forming a photoresist layer on the top surface of the at least one dielectric layer; providing a single photomask having at least one first pattern corresponding to a conductive via and at least one second pattern corresponding to a conductive trace; patterning the photoresist layer using the single photomask, for forming a trench in the photoresist corresponding to the conductive trace and an opening in a bottom surface of the trench corresponding to the via with a single photo exposure step; and etching the dielectric through the photoresist layer to form the trench and via therein. This application also relates to photomasks for use in the methods of this application.

Abstract translation: 一种方法，包括在半导体衬底上提供至少一个电介质层，所述至少一个电介质层具有顶表面和底表面; 在所述至少一个介电层的顶表面上形成光致抗蚀剂层; 提供具有对应于导电通孔的至少一个第一图案和对应于导电迹线的至少一个第二图案的单个光掩模; 使用单个光掩模图案化光致抗蚀剂层，用于在对应于导电迹线的光致抗蚀剂中形成沟槽，并且通过单次曝光步骤在对应于通孔的沟槽的底表面中形成开口; 并通过光致抗蚀剂层蚀刻电介质以在其中形成沟槽和通孔。 本申请还涉及用于本申请方法的光掩膜。