公开(公告)号：US20100118168A1

公开(公告)日：2010-05-13

申请号：US12327383

申请日：2008-12-03

申请人： Raymond J. SILVA ,  Dennis BOWLER ,  Gene ROBILLARD

发明人： Raymond J. SILVA ,  Dennis BOWLER ,  Gene ROBILLARD

IPC分类号： H04N5/335

CPC分类号： H01L25/065 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

摘要： A composite focal plane assembly with an expandable architecture has a multi-layer, double-sided aluminum nitride (AlN) substrate and vertical architecture to achieve the dual function of focal plane and electronics backplane. Imaging dice and other electrical components are mounted and wire bonded to one surface and then direct backplane connectivity is provided on the opposing surface through a matrix of electrical contacts. In one embodiment, a flexible connector is sandwiched between the AlN focal plane and a FR-4 backplane is used to compensate for differences in coefficient of thermal expansion (CTE) between the AlN and commercially available high density circuit card connectors that are commonly manufactured from materials with CTE properties more closely approximating FR-4. In an alternate embodiment, the FR-4 and flexible connectors are eliminated by using high density circuit card connectors that are fabricated out of materials more closely matching the CTE of AlN.

摘要翻译： 具有可扩展架构的复合焦平面组件具有多层双面氮化铝（AlN）基板和垂直架构，以实现焦平面和电子背板的双重功能。 成像芯片和其他电气元件安装在一个表面上，并且通过电触点矩阵在相对表面上提供直接背板连接。 在一个实施例中，柔性连接器夹在AlN焦平面之间，并且FR-4底板用于补偿AlN与商业上可获得的高密度电路卡连接器之间的热膨胀系数（CTE）的差异，其通常由 具有CTE性能的材料更接近于FR-4。 在替代实施例中，FR-4和柔性连接器通过使用由与AlN的CTE更匹配的材料制成的高密度电路卡连接器来消除。

公开(公告)号：US08400539B2

公开(公告)日：2013-03-19

申请号：US12327383

申请日：2008-12-03

申请人： Raymond J. Silva ,  Dennis Bowler ,  Gene Robillard

发明人： Raymond J. Silva ,  Dennis Bowler ,  Gene Robillard

IPC分类号： H04N3/14 ,  H04N5/335

CPC分类号： H01L25/065 ,  H01L2924/0002 ,  H04N5/2253 ,  H01L2924/00

摘要： A composite focal plane assembly with an expandable architecture has a multi-layer, double-sided aluminum nitride (AlN) substrate and vertical architecture to achieve the dual function of focal plane and electronics backplane. Imaging dice and other electrical components are mounted and wire bonded to one surface and then direct backplane connectivity is provided on the opposing surface through a matrix of electrical contacts. In one embodiment, a flexible connector is sandwiched between the AlN focal plane and a FR-4 backplane is used to compensate for differences in coefficient of thermal expansion (CTE) between the AlN and commercially available high density circuit card connectors that are commonly manufactured from materials with CTE properties more closely approximating FR-4. In an alternate embodiment, the FR-4 and flexible connectors are eliminated by using high density circuit card connectors that are fabricated out of materials more closely matching the CTE of AlN.