摘要:
Systems, including apparatus and methods, for driving airflow along a surface of a gimbal. The systems may comprise a gimbal apparatus including a payload and also including a gimbal mount supporting a first gimbal and a second gimbal. The first gimbal may be coupled pivotally to the gimbal mount. The second gimbal may be coupled pivotally to and supported by the first gimbal. The second gimbal may be coupled to and may support the payload. The gimbal apparatus may orient the payload by pivotal movement of the first and second gimbals relative to the gimbal mount about at least two nonparallel axes. The system also may comprise a fan mounted to the first gimbal. The systems also may comprise operating the fan to drive airflow through a gap disposed between the first and second gimbals.
摘要:
Gimbal system, including apparatus and methods, with forced flow of external air through a channel to remove heat. The system may comprise a support portion including at least one electronic component and defining a channel, a gimbal assembly pivotably connected to and supported by the support portion, and a payload pivotably orientable with respect to the support portion by the gimbal assembly. The support portion alone or collectively with the gimbal assembly may define a chamber in which the electronic component is disposed. The support portion may include a forced-air device configured to drive flow of external air through the channel, thereby removing heat transferred to the channel from the electronic component.
摘要:
Gimbal system, including apparatus and methods, with forced flow of external air through a channel to remove heat. The system may comprise a support portion including at least one electronic component and defining a channel, a gimbal assembly pivotably connected to and supported by the support portion, and a payload pivotably orientable with respect to the support portion by the gimbal assembly. The support portion alone or collectively with the gimbal assembly may define a chamber in which the electronic component is disposed. The support portion may include a forced-air device configured to drive flow of external air through the channel, thereby removing heat transferred to the channel from the electronic component.