公开(公告)号：US06589411B1

公开(公告)日：2003-07-08

申请号：US09852382

申请日：2001-05-10

Applicant: Matthias Kimpel ,  Martin Wulf ,  Oliver Reis ,  Gerhard Pech ,  Christoph Moelzer

Inventor： Matthias Kimpel ,  Martin Wulf ,  Oliver Reis ,  Gerhard Pech ,  Christoph Moelzer

IPC: C25D1300

CPC classification number: C25D13/22

Abstract: An electrodeposition coating process consisting of the successive process steps: 1) electrodeposition of a coating layer of an electrodeposition coating agent that contains a thermally curable binder system onto the surface of an electrically conductive substrate and 2) thermal curing of the electrodeposited coating layer by irradiation with near infrared radiation.

Abstract translation: 电沉积涂覆方法由以下连续的工艺步骤组成：1）将含有可热固化粘合剂体系的电沉积涂层剂的涂层电沉积到导电基材的表面上，2）通过照射电沉积涂层的热固化 近红外辐射。