Ablation instrument and method for cutting, fragmenting and/or removing material
    2.
    发明申请
    Ablation instrument and method for cutting, fragmenting and/or removing material 审中-公开
    用于切割,分割和/或去除材料的消融仪器和方法

    公开(公告)号:US20030109867A1

    公开(公告)日:2003-06-12

    申请号:US10077033

    申请日:2002-02-15

    IPC分类号: A61B018/18

    摘要: Ablation instrument is provided for cutting, fragmenting and/or removing material of an object, containing a carrier substrate, having at least one resistance-heated layer which is disposed on the substrate and made of doped diamond or diamond-like carbon (DLC) and also at least one electrical lead and at least one electrical discharge which are both electrically connected at different places by the resistance-heated layer.

    摘要翻译: 提供消融仪用于切割,分割和/或去除包含载体基底的物体的材料,该载体衬底具有至少一个电阻加热层,该电阻加热层设置在基底上并由掺杂的金刚石或类金刚石碳(DLC)制成, 还有至少一个电引线和至少一个放电电路,它们都通过电阻加热层在不同的地方电连接。