Method for defining windows with different etching depths simultaneously
    1.
    发明授权
    Method for defining windows with different etching depths simultaneously 有权
    同时定义具有不同蚀刻深度的窗口的方法

    公开(公告)号:US06589864B2

    公开(公告)日:2003-07-08

    申请号:US09803855

    申请日:2001-03-12

    IPC分类号: H01L214763

    CPC分类号: H01L29/66742 H01L29/42384

    摘要: A method for defining plural windows with different etching depths simultaneously is disclosed. The method includes steps of (a) forming a photoresist on a substrate having a multiple film structure thereon, (b) exposing a first region of the photoresist to a first exposure dose and a second region of the photoresist to a second exposure dose, (c) obtaining different remaining thickenesses of the photoresist on the first region and the second region by a development, and (d) etching the first region and the second region of the photoresist for forming the plural windows with different etching depths of the multiple film structure.

    摘要翻译: 公开了一种用于同时定义具有不同蚀刻深度的多个窗口的方法。 该方法包括以下步骤:(a)在其上具有多个膜结构的基底上形成光致抗蚀剂,(b)将光致抗蚀剂的第一区域暴露于第一曝光剂量和第二曝光剂量的第二区域( c)通过显影在第一区域和第二区域上获得光致抗蚀剂的不同剩余厚度,以及(d)蚀刻光致抗蚀剂的第一区域和第二区域,以形成具有不同蚀刻深度的多个窗口的多个膜结构 。