公开(公告)号：US20250041986A1

公开(公告)日：2025-02-06

申请号：US18697163

申请日：2022-09-09

Applicant: SANOH INDUSTRIAL CO., LTD. ,  NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGY ,  HITECHNOTH CORPORATION

Inventor： Hideo AIDA ,  Haruji KATAKURA ,  Natsuko OMIYA ,  Yasuyuki KOBORI

IPC: B24B37/005 ,  B24B37/30 ,  B24B49/16

Abstract: A polishing device includes a wafer holder (31) that holds a wafer (W) and that brings the held wafer (W) into contact with a polishing surface (22a); a polishing plate driver (24) or a head driver (34) that, when polishing the wafer (W), relatively rotates the wafer holder (31) with respect to the polishing surface (22a) to which a slurry (SL) is supplied; a polishing pressure applier (32) that applies polishing pressure to the wafer (W) by pressing the wafer (W) against the polishing surface (22a) via the wafer holder (31); and a controller (50) that, during polishing of the wafer (W), cyclically switches a state of the polishing pressure applied to the wafer (W) via the polishing pressure applier (32) between a high pressure state and a low pressure state in which the polishing pressure is lower than in the high pressure state.