公开(公告)号：US20110164356A1

公开(公告)日：2011-07-07

申请号：US12832415

申请日：2010-07-08

申请人： HSIN-WEI SHEN ,  CHIH-YI WANG ,  CHENG-HUNG LIN

发明人： HSIN-WEI SHEN ,  CHIH-YI WANG ,  CHENG-HUNG LIN

IPC分类号： H05K7/00

CPC分类号： H05K5/0204

摘要： A pad for portable electronics mounted on a housing of portable electronics is revealed. The pad includes a lower fastener, a buffer member arranged above the lower fastener, an upper fastener connected with the buffer member and mounted onto the housing, and a gripping member disposed above the upper fastener. The housing is arranged with an insertion hole. The gripping member penetrates the insertion hole and clips to a side wall of the housing. Thus there is no need to arrange the pad by adhesives or thermal fusion. Moreover, the height of the pad disposed is adjusted automatically by the buffer member. Therefore, the convenience of use of the pad is increased.

摘要翻译： 显示了用于安装在便携式电子设备外壳上的便携式电子设备的垫。 衬垫包括下紧固件，布置在下紧固件上方的缓冲构件，与缓冲构件连接并安装到壳体上的上紧固件，以及设置在上紧固件上方的夹紧构件。 壳体布置有插入孔。 夹持构件穿过插入孔并夹紧到壳体的侧壁。 因此，不需要通过粘合剂或热熔融来布置垫。 此外，通过缓冲构件自动调节所设置的垫的高度。 因此，使用垫的便利性增加。

公开(公告)号：US08264839B2

公开(公告)日：2012-09-11

申请号：US12832415

申请日：2010-07-08

申请人： Hsin-Wei Shen ,  Chih-Yi Wang ,  Chen-Hung Lin

发明人： Hsin-Wei Shen ,  Chih-Yi Wang ,  Chen-Hung Lin

IPC分类号： G06F1/16

CPC分类号： H05K5/0204

摘要： A pad for portable electronics mounted on a housing of portable electronics is revealed. The pad includes a lower fastener, a buffer member arranged above the lower fastener, an upper fastener connected with the buffer member and mounted onto the housing, and a gripping member disposed above the upper fastener. The housing is arranged with an insertion hole. The gripping member penetrates the insertion hole and clips to a side wall of the housing. Thus there is no need to arrange the pad by adhesives or thermal fusion. Moreover, the height of the pad disposed is adjusted automatically by the buffer member. Therefore, the convenience of use of the pad is increased.

摘要翻译： 显示了用于安装在便携式电子设备外壳上的便携式电子设备的垫。 衬垫包括下紧固件，布置在下紧固件上方的缓冲构件，与缓冲构件连接并安装到壳体上的上紧固件，以及设置在上紧固件上方的夹紧构件。 壳体布置有插入孔。 夹持构件穿过插入孔并夹紧到壳体的侧壁。 因此，不需要通过粘合剂或热熔融来布置垫。 此外，通过缓冲构件自动调节所设置的垫的高度。 因此，使用垫的便利性增加。