Method of fabricating gate electrode having polysilicon film and wiring metal film
    1.
    发明申请
    Method of fabricating gate electrode having polysilicon film and wiring metal film 审中-公开
    制造具有多晶硅膜和布线金属膜的栅电极的方法

    公开(公告)号:US20080200031A1

    公开(公告)日:2008-08-21

    申请号:US12007999

    申请日:2008-01-18

    IPC分类号: H01L21/44

    摘要: A method of forming a gate electrode of a semiconductor device according to example embodiments that may include forming a polysilicon film on a semiconductor substrate. An interface control layer may be formed on the polysilicon film by repeating a unit cycle a plurality of times. The unit cycle may include forming an interface metal film and nitriding an upper surface portion of the interface metal film to form an interface metal nitride film on an upper surface portion of the interface metal film. A wiring metal film may be formed on the interface control layer.

    摘要翻译: 根据示例实施例的形成半导体器件的栅电极的方法,其可以包括在半导体衬底上形成多晶硅膜。 可以通过多次重复单位周期在多晶硅膜上形成界面控制层。 单元循环可以包括形成界面金属膜并氮化界面金属膜的上表面部分以在界面金属膜的上表面部分上形成界面金属氮化物膜。 可以在界面控制层上形成布线金属膜。