公开(公告)号：US07227430B2

公开(公告)日：2007-06-05

申请号：US10495290

申请日：2002-10-28

申请人： Hardial Singh Gill ,  Stefan Koch ,  Rolf Lohrmann

发明人： Hardial Singh Gill ,  Stefan Koch ,  Rolf Lohrmann

IPC分类号： H01P5/12

CPC分类号： H01P1/047

摘要： A bondwire transition arrangement for interconnecting a signal port on one IC of a multichip module with a signal port on another, adjacent, IC of the same module employs a distributed signal-transition process in which the signal on one port appears as subsignals at tapping points along a series transmission-line segment arrangement between that port and ground on the same IC and the subsignals are recombined along a second series transmission-line segment arrangement connected between the other port and ground on the other IC. Spatially corresponding tapping points are interconnected via bondwires.

摘要翻译： 用于将多芯片模块的一个IC上的信号端口与相同模块的另一个IC上的信号端口互连的键合线转换装置采用分布式信号转换过程，其中一个端口上的信号在分接点处显示为子信号 沿同一IC上该端口和地之间的串联传输线段布置，并且子信号沿着连接在另一个IC上的另一个端口和地之间的第二串联传输线段布置重新组合。 空间相应的攻丝点通过焊接线相互连接。