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    Electrically heated apparatus employing a PTC heater for liquifying a rod of binding material
    4.
    发明授权
    Electrically heated apparatus employing a PTC heater for liquifying a rod of binding material 失效
    采用PTC加热器的电加热设备用于液化粘结材料杆

    公开(公告)号：US4493972A

    公开(公告)日：1985-01-15

    申请号：US333459

    申请日：1981-12-22

    申请人： Heinrich W. Steinel ,  Hans Siwon

    发明人： Heinrich W. Steinel ,  Hans Siwon

    IPC分类号： B05C17/005 ,  H05B1/02 ,  B67D5/62 ,  H01C7/02 ,  H05B3/02

    CPC分类号： B05C17/00546

    摘要： An apparatus for liquifying a rod of binding by application of heat includes a die-cast aluminum heating member having an elongated conical first channel decreasing in diameter from an inlet adapted to receive a rod of liquifiable bonding material through an elastic funnel surrounding the inlet to an outlet for discharging liquified material through a one-way valve. An electric heater is disposed in a second channel in said member parallel to the first channel and includes an elongated electrically insulating and elastic housing defining a cylindrical cartridge receiving at least one flat PTC resistor disposed between at least a pair of pressure bodies in the housing on opposite sides of the least one PTC resistor. At least one elongated, curved leaf spring is disposed between one of the pressure bodies and at least one PTC resistor for applying pressure to the bodies and the at least one PTC resistor to maintain constant contact pressure therebetween even under thermal expansion and contraction.

    摘要翻译： 用于通过施加热液化棒结合的装置包括压铸铝加热构件，该压铸铝加热构件具有从适于通过围绕入口的弹性漏斗接收液态粘合材料的入口直径减小的细长锥形第一通道， 通过单向阀排出液化材料的出口。 电加热器设置在平行于第一通道的所述构件中的第二通道中，并且包括细长的电绝缘和弹性壳体，其限定圆柱形筒体，其接收至少一个扁平PTC电阻器，该电阻器设置在壳体中的至少一对压力体之间， 最少一个PTC电阻的相对侧。 至少一个细长弯曲的板簧布置在其中一个压力体和至少一个PTC电阻器之间，用于向主体和至少一个PTC电阻器施加压力，以保持它们之间的恒定的接触压力，即使在热膨胀和收缩下也是如此。

    Chip that comprises an active agent and an integrated heating element
    5.
    发明授权
    Chip that comprises an active agent and an integrated heating element 失效
    芯片，其包含活性剂和集成的加热元件

    公开(公告)号：US07215878B2

    公开(公告)日：2007-05-08

    申请号：US10181087

    申请日：2001-01-03

    申请人： Hermann Neumann ,  Dietmar Kalder ,  Heinrich W. Steinel

    发明人： Hermann Neumann ,  Dietmar Kalder ,  Heinrich W. Steinel

    IPC分类号： F24F6/00

    CPC分类号： A01M1/2077 ,  A61L9/01 ,  A61L9/03

    摘要： Active compound chip and process for the production of an active compound chip comprising an active compound which is bound at room temperature, at least one heating element being located at least partly in the interior of the chip and the heating element having an electrical resistance and at least two electrical contacts.

    摘要翻译： 活性化合物芯片和用于生产活性化合物芯片的方法，所述活性化合物芯片包含在室温下结合的活性化合物，至少一个加热元件至少部分位于所述芯片的内部，所述加热元件具有电阻并且在 至少两个电气触点。