公开(公告)号：US20140147327A1

公开(公告)日：2014-05-29

申请号：US14232198

申请日：2012-07-27

申请人： Hiroaki Kurishita ,  Hideo Arakawa ,  Satoru Matsuo

发明人： Hiroaki Kurishita ,  Hideo Arakawa ,  Satoru Matsuo

IPC分类号： C22C1/05 ,  C22C27/04

CPC分类号： C22C1/05 ,  B22F3/15 ,  B22F2998/10 ,  C22C27/04 ,  C22C32/0052 ,  C22F1/18 ,  C22C1/1084

摘要： The present invention relates to the development of an alloy material with significantly improved low-temperature brittleness, recrystallization brittleness, and irradiation brittleness by the introduction of a recrystallization microstructure into an alloy, particularly a tungsten material, to significantly strengthen a weak grain boundary of the recrystallization microstructure. The present invention comprises the steps of: mechanically alloying at least one species selected from a group-IVA, VA, or VIA transition metal carbide and a metallic raw material; sintering base powders obtained through the mechanically alloying step, by using a hot isostatic press; and performing plastic deformation of at least 60% on the alloy obtained through the sintering step, at a strain rate between 10−5 s−1 and 10−2 S−1 and at a temperature between 500° C. and 2,000° C. It is therefore possible to obtain an alloy material with significantly improved low-temperature brittleness, recrystallization brittleness, and irradiation brittleness.

摘要翻译： 本发明涉及通过在合金，特别是钨材料中引入重结晶微观结构，显着提高低温脆性，再结晶脆性和照射脆性的合金材料的发展，显着增强了 再结晶微观结构。 本发明包括以下步骤：将选自IVA，VA或VIA过渡金属碳化物中的至少一种与金属原料机械合金化; 通过机械合金化步骤获得的烧结基础粉末，使用热等静压机; 并且在通过烧结步骤获得的合金上，在10 -5 s -1和10 -2 S -1之间的应变速率和500℃至2000℃的温度下进行至少60％的塑性变形。 因此，可以获得具有显着改善的低温脆性，再结晶脆性和照射脆性的合金材料。