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4 条记录 (耗时 0.009 秒)

    Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film
    1.
    发明授权
    Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film 失效
    在基板上形成催化剂核的过程，无电镀基板的工艺和改性的氧化锌膜

    公开(公告)号：US06723679B2

    公开(公告)日：2004-04-20

    申请号：US10120393

    申请日：2002-04-12

    申请人： Masanobu Izaki ,  Hiroshi Hatase ,  Yoshikazu Saijo

    发明人： Masanobu Izaki ,  Hiroshi Hatase ,  Yoshikazu Saijo

    IPC分类号： B01J2358

    CPC分类号： C23C18/1889

    摘要： A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.

    摘要翻译： 基板包括基板无电镀的非导电部分，其表面上具有平均粒径为1nm以下的银核和钯核的细金属催化剂粒子以高核密度粘附 的2000核/ mum2以上。 金属催化剂颗粒通过将基板浸渍在含有二价锡离子的敏化溶液中而使基板的非导电部分感光来制造，通过将基板浸渍在含有银离子的第一活化剂中来活化基板的非导电部分， 以及通过将衬底浸入含有钯离子的第二活化剂来活化衬底的非导电部分。

    Process for forming thin film of metal sulfides
    2.
    发明授权
    Process for forming thin film of metal sulfides 失效
    形成金属硫化物薄膜的方法

    公开(公告)号：US4885188A

    公开(公告)日：1989-12-05

    申请号：US910215

    申请日：1986-08-29

    申请人： Yo Hasegawa ,  Kazuyuki Okano ,  Akira Nakanishi ,  Hiroshi Hatase

    发明人： Yo Hasegawa ,  Kazuyuki Okano ,  Akira Nakanishi ,  Hiroshi Hatase

    IPC分类号： C23C18/12

    CPC分类号： C23C18/1204 ,  C23C18/1275

    摘要： This invention is designed to form thin films of metal sulfides usable in various types of electronic devices with a simple process comprising forming a layer of an organometallic compound having at least one metal-sulfur or metal-oxygen bond in the molecule on a substrate by printing or other means and then thermally decomposing the formed organometallic compound layer in an inert gas which may or may not be mixed with hydrogen sulfide.

    摘要翻译： PCT No.PCT / JP86 / 00015 Sec。 一九八六年八月二十九日 102（e）日期1986年8月29日PCT提交1986年1月16日PCT公布。 公开号WO86 / 04362 日期：1986年7月31日。本发明设计用于形成可用于各种类型的电子器件的金属硫化物薄膜，其包括在至少一种金属 - 硫或金属 - 氧键的有机金属化合物层 通过印刷或其它方式在基板上的分子，然后将形成的有机金属化合物层热分解成惰性气体，惰性气体可以或不与硫化氢混合。

    Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film
    3.
    发明授权
    Process of forming catalyst nuclei on substrate, process of electroless-plating substrate, and modified zinc oxide film 失效
    在基板上形成催化剂核的过程，无电镀基板的工艺和改性的氧化锌膜

    公开(公告)号：US06406750B1

    公开(公告)日：2002-06-18

    申请号：US09580557

    申请日：2000-05-30

    申请人： Masanobu Izaki ,  Hiroshi Hatase ,  Yoshikazu Saijo

    发明人： Masanobu Izaki ,  Hiroshi Hatase ,  Yoshikazu Saijo

    IPC分类号： B05D118

    CPC分类号： C23C18/1889

    摘要： A substrate includes a non-conductive portion to be electroless-plated of a substrate, on the surface of which fine metal catalyst particles composed of silver nuclei and palladium nuclei each having an average particle size of 1 nm or less adhere at a high nuclei density of 2000 nuclei/&mgr;m2 or more. The metal catalyst particles are produced by sensitizing the non-conductive portion of the substrate by dipping the substrate in a sensitizing solution containing bivalent tin ions, activating the non-conductive portion of the substrate by dipping the substrate in a first activator containing silver ions, and activating the non-conductive portion of the substrate by dipping the substrate in a second activator containing palladium ions.

    摘要翻译： 基板包括基板无电镀的非导电部分，其表面上具有平均粒径为1nm以下的银核和钯核的细金属催化剂粒子以高核密度粘附 的2000核/ mum2以上。 金属催化剂颗粒通过将基板浸渍在含有二价锡离子的敏化溶液中而使基板的非导电部分感光来制造，通过将基板浸渍在含有银离子的第一活化剂中来活化基板的非导电部分， 以及通过将衬底浸入含有钯离子的第二活化剂来活化衬底的非导电部分。