公开(公告)号：US5549244A

公开(公告)日：1996-08-27

申请号：US375109

申请日：1995-01-19

Applicant: Kazuyuki Kai ,  Masahisa Hamano ,  Hitoshi Homma ,  Akira Mori ,  Takashi Masuko

Inventor： Kazuyuki Kai ,  Masahisa Hamano ,  Hitoshi Homma ,  Akira Mori ,  Takashi Masuko

IPC: F01P7/16 ,  F16K31/68 ,  G05D23/13 ,  F01P7/02

CPC classification number: F01P7/16 ,  G05D23/022

Abstract: The present disclosure concerns a thermally controlled valve, such as may be installed in the cooling water system of internal combustion engines. The thermally controlled valve eliminates thermal hunting as the temperature of the cooling water increases by restricting the initial flow of cooling water. Subsequently, additional cooling water flow is permitted as the temperature of the cooling water further increases.

Abstract translation: 本公开涉及一种热控阀，例如可以安装在内燃机的冷却水系统中。 由于冷却水的温度通过限制冷却水的初始流量而增加，因此热控制阀消除了热量的捕获。 随后，随着冷却水的温度进一步增加，允许额外的冷却水流动。

公开(公告)号：US08252395B2

公开(公告)日：2012-08-28

申请号：US13034632

申请日：2011-02-24

Applicant: Shinji Kikuchi ,  Hideki Abe ,  Junichi Hosogoe ,  Tsuguhisa Hayashida ,  Hitoshi Homma

Inventor： Shinji Kikuchi ,  Hideki Abe ,  Junichi Hosogoe ,  Tsuguhisa Hayashida ,  Hitoshi Homma

IPC: B29D22/00

CPC classification number: B29C45/4407 ,  Y10T74/18056 ,  Y10T428/13

Abstract: An injection-molded body according to the present invention includes a tubular body portion, an airtight seal surface formed on a peripheral surface of the body portion near one end of the body portion, and a plurality of undercuts disposed at positions around the peripheral surface of the body portion that are closer to the end than the airtight seal surface is. The undercuts prevent a seal member mounted on the airtight seal surface from falling off, in which a clearance is formed between a peripheral wall and the undercuts. The peripheral wall defines an inner hole of the body portion, and the clearance accommodates deformation of the undercuts in radial directions.

Abstract translation: 根据本发明的注射成型体包括管状体部分，形成在本体部分的一端附近的主体部分的周面上的气密密封表面，以及设置在周边表面周围的位置处的多个底切部 比气密密封面更靠近端部的主体部分。 底切防止安装在气密密封表面上的密封件脱落，其中在周壁和底切之间形成间隙。 外围壁限定主体部分的内孔，并且间隙容纳底切部在径向方向上的变形。

公开(公告)号：US20110229666A1

公开(公告)日：2011-09-22

申请号：US13034632

申请日：2011-02-24

Applicant: Shinji KIKUCHI ,  Hideki ABE ,  Junichi HOSOGOE ,  Tsuguhisa HAYASHIDA ,  Hitoshi HOMMA

Inventor： Shinji KIKUCHI ,  Hideki ABE ,  Junichi HOSOGOE ,  Tsuguhisa HAYASHIDA ,  Hitoshi HOMMA

IPC: B32B1/08

CPC classification number: B29C45/4407 ,  Y10T74/18056 ,  Y10T428/13

Abstract: An injection-molded body according to the present invention includes a tubular body portion, an airtight seal surface formed on a peripheral surface of the body portion near one end of the body portion, and a plurality of undercuts disposed at positions around the peripheral surface of the body portion that are closer to the end than the airtight seal surface is. The undercuts prevent a seal member mounted on the airtight seal surface from falling off, in which a clearance is formed between a peripheral wall and the undercuts. The peripheral wall defines an inner hole of the body portion, and the clearance accommodates deformation of the undercuts in radial directions.

Abstract translation: 根据本发明的注射成型体包括管状体部分，形成在本体部分的一端附近的主体部分的周面上的气密密封表面，以及设置在周边表面周围的位置处的多个底切部 比气密密封面更靠近端部的主体部分。 底切防止安装在气密密封表面上的密封件脱落，其中在周壁和底切之间形成间隙。 外围壁限定主体部分的内孔，并且间隙容纳底切部在径向方向上的变形。

公开(公告)号：US06361626B1

公开(公告)日：2002-03-26

申请号：US09839371

申请日：2001-04-23

Applicant: Masayuki Kitajima ,  Hitoshi Homma ,  Masakazu Takesue ,  Tadaaki Shono ,  Yutaka Noda

Inventor： Masayuki Kitajima ,  Hitoshi Homma ,  Masakazu Takesue ,  Tadaaki Shono ,  Yutaka Noda

IPC: C22C1300

CPC classification number: C22C13/00 ,  B23K35/262 ,  C22C13/02

Abstract: A Pb-free solder alloy and a soldered bond using the same, in which the solder alloy has no harmful environmental effect but has a solderability comparable to that of the conventional Pb—Sn solder alloy. The solder alloy of the present invention either consists of Zn: 3.0-14.0 wt %, Al: 0.0020-0.0080 wt %, and the balance of Sn and unavoidable impurities or consists of Zn: 3.0-14.0 wt %, Bi: 3.0-6.0 wt %, Al: 0.0020-0.0100 wt %, and the balance of Sn and unavoidable impurities. The soldered bond of the present invention consists of either of the present inventive solder alloys.

Abstract translation: 无铅焊料合金和使用其的焊接焊料，其中焊料合金没有有害的环境效应，但具有与常规Pb-Sn焊料合金相当的可焊性。 本发明的焊料合金由Zn：3.0〜14.0重量％，Al：0.0020〜0.0080重量％，余量由Sn和不可避免的杂质构成，Zn：3.0〜14.0重量％，Bi：3.0-6.0 wt％，Al：0.0020-0.0100wt％，余量为Sn和不可避免的杂质。 本发明的焊接键由本发明的焊料合金中的任一种组成。