Abstract:
A method for automatically inspecting positive and negative polar directions of a polar element on a substrate is provided. Firstly, an image of a standard substrate is retrieved to form a standard sample, and relevant data of the polar elements on a substrate to be inspected is obtained to form the inspected sample. Then, transforming the geometry coordinates to the pixel coordinates, using different shapes of frames to make each polar element be positioned within, and marking the positions, positive and negative polar directions of all the polar elements in the image of the standard substrate. A database is set up to record the relevant data of each polar element as the standard sample for inspecting. The standard sample is compared with all the samples to be inspected to inspect whether the polar directions of each polar element is correct or not.
Abstract:
A method for automatically inspecting positive and negative polar directions of a polar element on a substrate is provided. Firstly, an image of a standard substrate is retrieved to form a standard sample, and relevant data of the polar elements on a substrate to be inspected is obtained to form the inspected sample. Then, transforming the geometry coordinates to the pixel coordinates, using different shapes of frames to make each polar element be positioned within, and marking the positions, positive and negative polar directions of all the polar elements in the image of the standard substrate. A database is set up to record the relevant data of each polar element as the standard sample for inspecting. The standard sample is compared with all the samples to be inspected to inspect whether the polar directions of each polar element is correct or not.
Abstract:
A circuit board detecting device and a detecting method are provided. The circuit board detecting device includes an image capture apparatus and a main unit. The image capture apparatus is coupled to the main unit to capture images of the surfaces of a sample circuit board and a test circuit board. In addition, the main unit is used to receive a sample frame and a test frame and compare the images of every object on the sample frame with the images of every object on the test frame to confirm if the test circuit board has flaws on the surface.
Abstract:
A method for finding a specific pattern is used to find a specific pattern in an image to be tested. The method comprises the following steps of: acquiring an image to be tested; performing a binary thresholding process on the image to be tested, thereby transforming the image to be tested into a binary image; performing a mosaic process on the binary image, thereby transforming the binary image into a mosaic image; utilizing a correlation coefficient method to find the specific pattern most similar to an image template from the mosaic image, wherein the image template is a desired mosaic pattern of the specific pattern; and transforming the mosaic image back into the binary image so as to find the coordinate of the specific pattern accurately.