摘要:
A notebook computer includes a housing, a CPU, a memory, a display, a storage device, a detachable battery pack and a keyboard module. The notebook computer is characterized in that the housing includes a predefined space and a connection interface disposed in the predefined space. The connection interface is electrically connected to the CPU. The notebook computer includes a plurality of electronic device modules. Each electronic device module includes a casing portion and a main body portion, and the main body portion includes a transmission interface. The size of each electronic device module may correspond to the size of the predefined space. Each electronic device module may be secured in the predefined space for combination with the housing, and the transmission interface is electrically connected to the connection interface for power or data transmission. The plurality of electronic device modules are capable of combining individually with the housing for replacing different functions.
摘要:
A notebook computer includes a housing, a CPU, a memory, a display, a storage device, a detachable battery pack and a keyboard module. The notebook computer is characterized in that the housing includes a predefined space and a connection interface disposed in the predefined space. The connection interface is electrically connected to the CPU. The notebook computer includes a plurality of electronic device modules. Each electronic device module includes a casing portion and a main body portion, and the main body portion includes a transmission interface. The size of each electronic device module may correspond to the size of the predefined space. Each electronic device module may be secured in the predefined space for combination with the housing, and the transmission interface is electrically connected to the connection interface for power or data transmission. The plurality of electronic device modules are capable of combining individually with the housing for replacing different functions.
摘要:
The present disclosure provides an image sensor device and a method for manufacturing the image sensor device. An exemplary image sensor device includes a substrate having a front surface and a back surface; a plurality of sensor elements disposed at the front surface of the substrate, each of the plurality of sensor elements being operable to sense radiation projected towards the back surface of the substrate; a radiation-shielding feature disposed over the back surface of the substrate and horizontally disposed between each of the plurality of sensor elements; a dielectric feature disposed between the back surface of the substrate and the radiation-shielding feature; and a metal layer disposed along sidewalls of the dielectric feature.
摘要:
The invention discloses a method for producing a nitrogen-silicon containing stainless steel layer on a metal. The method includes a pack cementation process involving the use of silicon nitride, silica and sodium fluoride as the source materials.
摘要:
The present disclosure provides an image sensor device and a method for manufacturing the image sensor device. An exemplary image sensor device includes a substrate having a front surface and a back surface; a plurality of sensor elements disposed at the front surface of the substrate, each of the plurality of sensor elements being operable to sense radiation projected towards the back surface of the substrate; a radiation-shielding feature disposed over the back surface of the substrate and horizontally disposed between each of the plurality of sensor elements; a dielectric feature disposed between the back surface of the substrate and the radiation-shielding feature; and a metal layer disposed along sidewalls of the dielectric feature.