-
公开(公告)号：US06939501B2
公开(公告)日：2005-09-06
申请号：US10608749
申请日：2003-06-26
Applicant: Ford B. Grigg , James M. Ocker , Rick A. Leininger
Inventor： Ford B. Grigg , James M. Ocker , Rick A. Leininger
CPC classification number: H01L23/544 , B29C64/135 , B29C2037/80 , B29K2995/0073 , B29L2031/3406 , B33Y30/00 , B33Y50/00 , B33Y80/00 , H01L2223/54406 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , Y10T428/12361 , Y10T428/22 , Y10T428/24273 , Y10T428/24281 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24802 , Y10T428/24835 , Y10T428/24851 , Y10T428/31667
Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package. The marking may be formed as apertures through or recesses in one or more stereolithographically fabricated layers of material, or the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. Raised markings may also be formed on the surfaces of packaged or bare semiconductor device components. Alternatively, the marking may be fabricated separately from a semiconductor device component, then secured thereto. Methods for stereolithographically marking semiconductor device components are also disclosed. A machine vision system may be used in such methods so as to recognize the position and orientation of a semiconductor device or other substrate to be stereolithographically marked.
Abstract translation: 用于半导体器件部件（例如封装或未封装的半导体器件或另一基底）的立体光刻制造的标记。 当形成在具有立体光刻形成的封装结构的半导体器件上时，标记可以与封装成一体。 标记可以形成为一个或多个立体光刻制造的材料层中的通孔或凹槽，或者标记可以包括从半导体器件部件的表面突出的一个或多个立体光刻制造的层。 凸起的标记也可以形成在封装或裸露的半导体器件部件的表面上。 或者，标记可以与半导体器件部件分开制造，然后固定到其上。 还公开了用于立体定向标记半导体器件部件的方法。 可以以这种方法使用机器视觉系统，以便识别半导体器件或其他基板的位置和取向以进行立体光刻标记。
-
公开(公告)号：US06635333B2
公开(公告)日：2003-10-21
申请号：US09942242
申请日：2001-08-29
Applicant: Ford B. Grigg , James M. Ocker , Rick A. Leininger
Inventor： Ford B. Grigg , James M. Ocker , Rick A. Leininger
IPC: B32B310
CPC classification number: H01L23/544 , B29C64/135 , B29C2037/80 , B29K2995/0073 , B29L2031/3406 , B33Y30/00 , B33Y50/00 , B33Y80/00 , H01L2223/54406 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , Y10T428/12361 , Y10T428/22 , Y10T428/24273 , Y10T428/24281 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24802 , Y10T428/24835 , Y10T428/24851 , Y10T428/31667
Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When the marking is formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package structure. The marking may be formed as apertures through or recessed areas in one or more stereolithographically fabricated layers of material. Alternatively, the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. The marking may be formed directly on a surface of a packaged or bare semiconductor device component. As an alternative, the marking can be fabricated separately from a semiconductor device component, then secured thereto. Methods of stereolithographically marking semiconductor device components are also disclosed.
-
Patent Agency Ranking
公开(公告)号：US06489007B2
公开(公告)日：2002-12-03
申请号：US09736794
申请日：2000-12-14
Applicant: Ford B. Grigg , James M. Ocker , Rick A. Leininger
Inventor： Ford B. Grigg , James M. Ocker , Rick A. Leininger
IPC: B32B310
CPC classification number: H01L23/544 , B29C64/135 , B29C2037/80 , B29K2995/0073 , B29L2031/3406 , B33Y30/00 , B33Y50/00 , B33Y80/00 , H01L2223/54406 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , Y10T428/12361 , Y10T428/22 , Y10T428/24273 , Y10T428/24281 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24802 , Y10T428/24835 , Y10T428/24851 , Y10T428/31667
Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When formed on a semiconductor device with a stereolithographicaily formed package structure, the marking may be integral with the package. The marking may be formed as apertures through or recesses in one or more stereolithographically fabricated layers of material, or the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. Raised markings may also be formed on the surfaces of packaged or bare semiconductor device components. Alternatively, the marking may be fabricated separately from a semiconductor device component, then secured thereto. Methods for stereolithographically marking semiconductor device components are also disclosed. A machine vision system may be used in such methods so as to recognize the position and orientation of a semiconductor device or other substrate to be stereolithographically marked.
Abstract translation: 用于半导体器件部件（例如封装或未封装的半导体器件或另一基底）的立体光刻制造的标记。 当形成在具有立体光刻形成的封装结构的半导体器件上时，标记可以与封装成一体。 标记可以形成为一个或多个立体光刻制造的材料层中的通孔或凹槽，或者标记可以包括从半导体器件部件的表面突出的一个或多个立体光刻制造的层。 凸起的标记也可以形成在封装或裸露的半导体器件部件的表面上。 或者，标记可以与半导体器件部件分开制造，然后固定到其上。 还公开了用于立体定向标记半导体器件部件的方法。 可以以这种方法使用机器视觉系统，以便识别半导体器件或其他基板的位置和取向以进行立体光刻标记。
-
公开(公告)号：US06703105B2
公开(公告)日：2004-03-09
申请号：US10301209
申请日：2002-11-21
Applicant: Ford B. Grigg , James M. Ocker , Rick A. Leininger
Inventor： Ford B. Grigg , James M. Ocker , Rick A. Leininger
IPC: B32B310
CPC classification number: H01L23/544 , B29C64/135 , B29C2037/80 , B29K2995/0073 , B29L2031/3406 , B33Y30/00 , B33Y50/00 , B33Y80/00 , H01L2223/54406 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , Y10T428/12361 , Y10T428/22 , Y10T428/24273 , Y10T428/24281 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24802 , Y10T428/24835 , Y10T428/24851 , Y10T428/31667
Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package. The marking may be formed as apertures through or recesses in one or more stereolithographically fabricated layers of material, or the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. Raised markings may also be formed on the surfaces of packaged or bare semiconductor device components. Alternatively, the marking may be fabricated separately from a semiconductor device component, then secured thereto. Methods for stereolithographically marking semiconductor device components are also disclosed. A machine vision system may be used in such methods so as to recognize the position and orientation of a semiconductor device or other substrate to be stereolithographically marked.
Abstract translation: 用于半导体器件部件（例如封装或未封装的半导体器件或另一基底）的立体光刻制造的标记。 当形成在具有立体光刻形成的封装结构的半导体器件上时，标记可以与封装成一体。 标记可以形成为一个或多个立体光刻制造的材料层中的通孔或凹槽，或者标记可以包括从半导体器件部件的表面突出的一个或多个立体光刻制造的层。 凸起的标记也可以形成在封装或裸露的半导体器件部件的表面上。 或者，标记可以与半导体器件部件分开制造，然后固定到其上。 还公开了用于立体定向标记半导体器件部件的方法。 可以以这种方法使用机器视觉系统，以便识别半导体器件或其他基板的位置和取向以进行立体光刻标记。
-
公开(公告)号：US06585927B2
公开(公告)日：2003-07-01
申请号：US09736624
申请日：2000-12-14
Applicant: Ford B. Grigg , James M. Ocker , Rick A. Leininger
Inventor： Ford B. Grigg , James M. Ocker , Rick A. Leininger
IPC: B29C3508
CPC classification number: H01L23/544 , B29C64/135 , B29C2037/80 , B29K2995/0073 , B29L2031/3406 , B33Y30/00 , B33Y50/00 , B33Y80/00 , H01L2223/54406 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , Y10T428/12361 , Y10T428/22 , Y10T428/24273 , Y10T428/24281 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24802 , Y10T428/24835 , Y10T428/24851 , Y10T428/31667
Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package. The marking may be formed as apertures through or recesses in one or more stereolithographically fabricated layers of material, or the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. Raised markings may also be formed on the surfaces of packaged or bare semiconductor device components. Alternatively, the marking may be fabricated separately from a semiconductor device component, then secured thereto. Methods for stereolithographically marking semiconductor device components are also disclosed. A machine vision system may be used in such methods so as to recognize the position and orientation of a semiconductor device or other substrate to be stereolithographically marked.
Abstract translation: 用于半导体器件部件（例如封装或未封装的半导体器件或另一基底）的立体光刻制造的标记。 当形成在具有立体光刻形成的封装结构的半导体器件上时，标记可以与封装成一体。 标记可以形成为一个或多个立体光刻制造的材料层中的通孔或凹槽，或者标记可以包括从半导体器件部件的表面突出的一个或多个立体光刻制造的层。 凸起的标记也可以形成在封装或裸露的半导体器件部件的表面上。 或者，标记可以与半导体器件部件分开制造，然后固定到其上。 还公开了用于立体定向标记半导体器件部件的方法。 可以以这种方法使用机器视觉系统，以便识别半导体器件或其他基板的位置和取向以进行立体光刻标记。
-
公开(公告)号：US06706374B2
公开(公告)日：2004-03-16
申请号：US10301087
申请日：2002-11-21
Applicant: Ford B. Grigg , James M. Ocker , Rick A. Leininger
Inventor： Ford B. Grigg , James M. Ocker , Rick A. Leininger
IPC: B32B310
CPC classification number: H01L23/544 , B29C64/135 , B29C2037/80 , B29K2995/0073 , B29L2031/3406 , B33Y30/00 , B33Y50/00 , B33Y80/00 , H01L2223/54406 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , Y10T428/12361 , Y10T428/22 , Y10T428/24273 , Y10T428/24281 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24802 , Y10T428/24835 , Y10T428/24851 , Y10T428/31667
Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package. The marking may be formed as apertures through or recesses in one or more stereolithographically fabricated layers of material, or the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. Raised markings may also be formed on the surfaces of packaged or bare semiconductor device components. Alternatively, the marking may be fabricated separately from a semiconductor device component, then secured thereto. Methods for stereolithographically marking semiconductor device components are also disclosed. A machine vision system may be used in such methods so as to recognize the position and orientation of a semiconductor device or other substrate to be stereolithographically marked.
-
公开(公告)号：US06337122B1
公开(公告)日：2002-01-08
申请号：US09481779
申请日：2000-01-11
Applicant: Ford B. Grigg , James M. Ocker , Rick A. Leininger
Inventor： Ford B. Grigg , James M. Ocker , Rick A. Leininger
IPC: B32B300
CPC classification number: H01L23/544 , B29C64/135 , B29C2037/80 , B29K2995/0073 , B29L2031/3406 , B33Y30/00 , B33Y50/00 , B33Y80/00 , H01L2223/54406 , H01L2223/54473 , H01L2223/5448 , H01L2224/16 , Y10T428/12361 , Y10T428/22 , Y10T428/24273 , Y10T428/24281 , Y10T428/24298 , Y10T428/24306 , Y10T428/24314 , Y10T428/24802 , Y10T428/24835 , Y10T428/24851 , Y10T428/31667
Abstract: A stereolithographically fabricated marking for a semiconductor device component, such as a packaged or unpackaged semiconductor device or another substrate. When the marking is formed on a semiconductor device with a stereolithographically formed package structure, the marking may be integral with the package structure. The marking may be formed as apertures through or recessed areas in one or more stereolithographically fabricated layers of material. Alternatively, the marking may include one or more stereolithographically fabricated layers that protrude from a surface of a semiconductor device component. The marking may be formed directly on a surface of a packaged or bare semiconductor device component. As an alternative, the marking can be fabricated separately from a semiconductor device component, then secured thereto. Methods of stereolithographically marking semiconductor device components are also disclosed. The stereolithographic method may include use of a machine vision system including at least one camera operably associated with a computer controlling a stereolithographic application of material so that the system may recognize the position and orientation of a semiconductor device or other substrate that is to be stereolithographically marked.
Abstract translation: 用于半导体器件部件（例如封装或未封装的半导体器件或另一基底）的立体光刻制造的标记。 当标记形成在具有立体光刻形成的封装结构的半导体器件上时，标记可以与封装结构一体。 标记可以形成为一个或多个立体光刻制造的材料层中的通孔或凹陷区域。 或者，标记可以包括从半导体器件部件的表面突出的一个或多个立体光刻制造的层。 标记可以直接形成在封装或裸露的半导体器件部件的表面上。 作为替代，标记可以与半导体器件部件分开制造，然后固定到其上。 还公开了立体光刻标记半导体器件部件的方法。 立体光刻方法可以包括使用机器视觉系统，其包括与控制材料的立体光刻应用的计算机可操作地相关联的至少一个照相机，使得系统可以识别半导体器件或其他要被立体光刻标记的衬底的位置和取向 。
-
-
-
-
-
-
Search Results
7
records
(took 0.012 seconds)
