公开(公告)号：US4485218A

公开(公告)日：1984-11-27

申请号：US349736

申请日：1982-02-18

申请人： Gordon M. Bell ,  James R. Ridlen

发明人： Gordon M. Bell ,  James R. Ridlen

IPC分类号： C08L9/00 ,  H01B3/44 ,  C08F279/02

CPC分类号： H01B3/44 ,  C08L9/00 ,  Y10T428/2947 ,  Y10T428/31696

摘要： Encapsulating compositions for inductive devices have a polybutadiene base, predominate in trans-1,4 polybutadiene, and include cis-1,4 polybutadiene and vinyl-1,2 polybutadiene, together with an initiator, an inhibitor and a co-agent for improving the curing of the composition. The compositions are usable at higher temperatures, based on a conditioning of the composition during cure at or near the projected use temperature. When combined with high temperature conductor insulation coatings, such as polyimides, a high temperature soft cure encapsulation is achieved from which an inductive device may be liberated without damage to the device.

摘要翻译： 用于感应装置的封装组合物具有聚丁二烯基，在反式-1,4-聚丁二烯中占优势，并且包括顺式-1,4-聚丁二烯和乙烯基-1,2-聚丁二烯，以及引发剂，抑制剂和用于改善 固化组合物。 基于在预期使用温度或接近预期使用温度下固化期间组合物的调理，组合物可用于较高温度。 当与诸如聚酰亚胺的高温导体绝缘涂层组合时，实现了高温软固化封装，可以从其释放感应器件而不损坏器件。

公开(公告)号：US4595616A

公开(公告)日：1986-06-17

申请号：US662644

申请日：1984-10-19

申请人： Gordon M. Bell ,  James R. Ridlen

发明人： Gordon M. Bell ,  James R. Ridlen

IPC分类号： C08L9/00 ,  H01B3/44

CPC分类号： H01B3/44 ,  C08L9/00 ,  Y10T428/23 ,  Y10T428/239 ,  Y10T428/31931

摘要： Improved encapsulating compositions for inductive devices are provided. The composition has a polybutadiene base and contains an initiator, an inhibitor and a co-agent for improving the curing of the composition under the influence of the initiator.Certain compositions are usable at higher temperatures than prior polybutadiene base encapsulating compounds based on a conditioning of the composition during cure at or near the projected use temperature. When combined with high temperature conductor insulation coatings, such as polyimides, a high temperature encapsulating system is achieved.Certain compositions are usable to provide a soft cure encapsulation from which an encapsulated inductive device may be liberated without damage to the device. For such compositions, soft curable polybutadienes are employed and particularly those having high trans and cis components.

摘要翻译： 提供了用于感应装置的改进的封装组合物。 该组合物具有聚丁二烯基，并含有引发剂，抑制剂和助剂，用于在引发剂的影响下改善组合物的固化。 某些组合物可在比现有聚丁二烯基封装化合物更高的温度下使用，基于组合物在预期使用温度或接近预期使用温度下固化期间的调理。 当与诸如聚酰亚胺的高温导体绝缘涂层组合时，实现了高温封装系统。 某些组合物可用于提供软固化封装，可以从其中释放封装的感应器件而不损坏器件。 对于这样的组合物，使用软固化聚丁二烯，特别是具有高反式和顺式组分的那些。