LED Light Fixture With Improved Thermal Management
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    发明申请
    LED Light Fixture With Improved Thermal Management 审中-公开
    LED灯具具有改进的热管理

    公开(公告)号:US20130242573A1

    公开(公告)日:2013-09-19

    申请号:US13512976

    申请日:2009-12-14

    IPC分类号: F21V29/00

    摘要: A light fixture (10), having a circuit board (20) having first and second major surfaces (20a and 20b); at least one light emitting diode (25) mounted on the first major surface (20a) of the circuit board (20); an enclosure (30) formed of a material having two major surfaces (30a and 30b) and a thermo-mechanical design constant of at least 20 mm-W/m*K and shaped so as to define an opening (32) and a cavity (33), one of the major surfaces (30a) of the material defining the surface of the cavity (33) and the enclosure (30) positioned so as to enclose the second major surface (20b) of the circuit board (20); a heat spreader (40) having a surface area at least twice that of the circuit board and a thermo-mechanical design constant of at least 10 mm-W/m*K, the heat spreader (40) positioned in thermal contact with both the circuit board (20) and the enclosure (30).

    摘要翻译: 一种灯具(10),具有具有第一和第二主表面(20a和20b)的电路板(20)。 安装在电路板(20)的第一主表面(20a)上的至少一个发光二极管(25); 由具有两个主表面(30a和30b)和至少20mm-W / m * K的热机械设计常数的材料形成的外壳(30),并且形成为限定开口(32)和腔 (33),所述材料的主表面(30a)中的一个限定所述空腔(33)的表面和所述外壳(30),其被定位成包围所述电路板(20)的所述第二主表面(20b); 散热器(40)具有至少两倍于电路板的表面积和热机械设计常数至少为10mm-W / m * K的散热器(40),散热器(40)定位成与两个 电路板(20)和外壳(30)。